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ABS Material Waffle Pack Chip Trays with Various Thickness for Secure Chip Protection

ABS Material Waffle Pack Chip Trays with Various Thickness for Secure Chip Protection

Brand Name: Hiner-pack
Model Number: HN25263
MOQ: 1000
Price: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Tray Weight:
Varies, Typically Up To 500 Grams Per Cavity
Color:
Black
Quality Assurance:
Delivery Guarantee, Reliable Quality
Outline Line Size:
101.6×101.6×5.5 Mm
Cavity Size:
7×12.2×1.8 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Warpage:
Warpage MAX 0.22mm
Capacity:
6×9=54 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Highlight:

ABS Waffle Pack Chip Trays

,

Various Thickness Chip Trays

,

Secure Chip Protection Trays

Product Description
Waffle Pack Chip Trays ABS Material Various Thickness For Secure Chip Protection
Searching for reliable trays to safeguard sensitive semiconductor chips? Hold chips steadily inside precision molded cavities. Prevent scratches and static damage during frequent testing and transfer. Keep components fixed without shifting across different working steps.

Made of sturdy ABS material with multiple thickness options. Feature orderly pin-style cavity layout. Fit automated pick and place equipment smoothly. Maintain stable anti-static performance inside cleanroom environments.

Support adjustments on cavity shape and tray thickness. Match diverse chip outlines and production requirements. Accept sample orders and mass production orders. Meet varied packaging demands from electronics manufacturers.
Key Features/ Benefits 
  • Precision cavity layout
  • Multiple thickness selections
  • Secure chip holding
  • Stable anti static property
  • Compatible with automatic equipment
Specifications
Brand Hiner-pack
Model HN25263
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 101.6×101.6×5.5 mm
Cavity Size  7×12.2×1.8 mm
Matrix QTY  6×9=54 PCS
Warpage  MAX 0.22mm
Service  Accept OEM, ODM
Custom Pocket Options  Available
Applications
Support semiconductor testing and sorting workflows. Secure IC parts during inspection and transfer. Help maintain stable operation in cleanroom production areas.

Serve electronic component inventory storage. Protect chips during cross-region shipment. Keep components intact before final assembly and packaging.
Customized Services
Provide full customization for cavity shape size and tray thickness. Adjust overall dimension to fit different chip specifications. Arrange prototype samples for customer verification before mass run. Accept small trial batches and large bulk orders.

 Tune surface static index to satisfy special cleanroom standards. Arrange flexible production schedule to shorten lead time. Deliver consistent technical guidance through whole cooperation cycle.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers