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Static Dissipative ABS Waffle Pack Chip Trays for Semiconductor Chip Protection and IC Chip Trays Handling

Brand Name:	Hiner-pack
Model Number:	HN25264
MOQ:	1000
Price:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Tray Weight:

Varies, Typically Up To 500 Grams Per Cavity

Color:

Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Outline Line Size:

101.6×101.6×5.5 Mm

Cavity Size:

7.0×6.0×1.1 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.23mm

Capacity:

10×11=110 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

Static Dissipative ABS Waffle Pack

ABS Waffle Pack Chip Trays

Semiconductor Chip Protection Trays

Product Description

Static Dissipative ABS Waffle Pack Chip Trays For Semiconductor Chip Protection

Looking for dependable carriers to protect delicate semiconductor chips? Lock chips steadily within neatly molded cavities. Lower static hazards and surface wear through testing and movement. Prevent component displacement on production workflows.

Built from tough ABS with static dissipative function. Print dimension specs and PIN1 orientation marks on tray surface. Adapt to automated pick and test operations. Keep stable anti-static effect in cleanroom environments.

Allow adjustments to cavity size and overall shape. Accommodate varied chip sizes and project demands. Welcome sample validation and mass production orders. Satisfy unique packaging needs for electronic manufacturers.

Key Features/ Benefits

Reliable ESD protection for sensitive semiconductor parts
Stable static dissipative property
Smooth scratch-resistant surface
Compatible with auto test machines
Precision molded cavities

Specifications

Brand		Hiner-pack
Model		HN25264
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		101.6×101.6×5.5 mm
Cavity Size		7.0×6.0×1.1 mm
Matrix QTY		10×11=110 PCS
Warpage		MAX 0.23mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Work for semiconductor sorting and testing flows. Hold IC parts safely during inspection and transfer. Deliver stable performance within cleanroom production lines.

Used for electronic component inventory storage. Protect chips through long distance transport. Preserve part condition before final assembly.

Packaging & Shipping/ Services

Pack trays inside anti-static bags then export cartons. Add separating layers to prevent rubbing and scratches. Print shipping labels clearly on cartons. Work with DHL FedEx UPS and other logistics partners. Support FOB EXW FCA trade terms. Track shipments after dispatch and share delivery updates timely for buyers

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Static Dissipative ABS Waffle Pack Chip Trays for Semiconductor Chip Protection and IC Chip Trays Handling

Static Dissipative ABS Waffle Pack Chip Trays for Semiconductor Chip Protection and IC Chip Trays Handling

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