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Dense Uniform Cavities Waffle Pack Chip Trays with High Loading Capacity for Fine Pitch IC Testing and Sorting

Brand Name:	Hiner-pack
Model Number:	HN26001
MOQ:	1000
Price:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ROHS, ISO

Color:

Usually Black

Quality Assurance:

Delivery Guarantee, Reliable Quality

Cavity Size:

1.1014×1.412×0.3 Mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Mold Type:

Injection

Reusable:

Yes

Tray Shape:

Rectangular

Clean Class:

General And Ultrasonic Cleaning

Ic Type:

BGA,QFP,QFN,LGA,PGA

Packing Level:

Transport Package

Warpage:

Warpage MAX 0.25mm

Capacity:

21×23=483 PCS

Packaging Details:

CARTON, PALLET

Supply Ability:

2000PCS/Day

Highlight:

Waffle Pack Chip Trays for Testing

Semiconductor Component Waffle Trays

Waffle Pack Trays for Sorting

Product Description

Strong Waffle Pack Chip Trays Hold Semiconductor Components For Testing Sorting

Stabilize chips reliably during test and sorting operations. Lock ICs firmly inside neatly arranged cavities. Reduce slip risks and surface scratches from repeated handling. Enable smooth automated pick and place along production lines.

Built with high rigidity PC raw material. Offer stable conductive static control. Dense uniform cavity layout accommodates large batches of chips. Resist bending under stacking pressure, maintain consistent performance inside cleanroom environments.

Support tailor-made cavity layout and outer dimensions. Adapt to different IC shapes and test fixture requirements. Provide sample validation before mass production. Meet special turnover and storage demands for electronic manufacturing plants.

Key Features/ Benefits

Dense Uniform Cavities
High Loading Capacity
Suitable for Delicate Fine Pitch ICs
More than 12 years of export experience.
Guards ESD-sensitive fine pitch integrated circuits
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN26001
Color		Usually black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		101.6×101.6×5.2 mm
Cavity Size		1.1014×1.412×0.3 mm mm
Matrix QTY		21×23=483 PCS
Warpage		MAX 0.25mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Match semiconductor automated test and sorting workflows. Keep ICs stable during inspection and grading. Fit cleanroom mass production stations.

Serve chip circulation and intermediate storage. Protect components from collision when transferring across production processes. Reduce rejects caused by shifting parts.

Customized Services

Customize cavity count dimension and overall tray outline. Tune cavity depth to suit different chip thickness. Supply prototype samples for performance confirmation before mass production.

Accept pilot small orders and high-volume bulk orders. Adjust static conductivity to satisfy special workshop standards. Flexible production plans shorten lead time and supply ongoing technical support.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle Pack Trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Dense Uniform Cavities Waffle Pack Chip Trays with High Loading Capacity for Fine Pitch IC Testing and Sorting

Dense Uniform Cavities Waffle Pack Chip Trays with High Loading Capacity for Fine Pitch IC Testing and Sorting

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