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DRAM IC ESD Component Tray For Electronics Parts Packing

DRAM IC ESD Component Tray For Electronics Parts Packing

Brand Name:	Hiner-pack
Model Number:	HN1876 Yellow
MOQ:	1000 pcs
Price:	$1.35~$2.38(Prices are determined according to different incoterms and quantities）
Payment Terms:	T/T
Supply Ability:	The capacity is between 2500PCS~3000PCS/per day

Detail Information

Product Description

Detail Information

Place of Origin:

Made In China

Certification:

ISO 9001 ROHS SGS

Material:

Color:

Yellow

Temperature:

100°C

Property:

ESD

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Flatness:

Less Than 0.76mm

Clean Class:

General And Ultrasonic Cleaning

Incoterms:

EXW, FOB, CIF, DDU, DDP

Customized Service:

Support Standard And Non-standard, Precision Machining

Injection Mold:

Customized Case Need (Lead Time 25~30Days, Mold Life Span: 300,000 Times.)

Packaging Details:

80~100pcs/per carton

Supply Ability:

The capacity is between 2500PCS~3000PCS/per day

Highlight:

IC ESD Component Tray

DRAM ESD Component Tray

IC esd tray

Product Description

DRAM IC ESD Component Tray For Electronics Parts Packing

Enhance automation and protection with JEDEC trays designed around your product, not the other way around.

Features:

1. Designs conform to the JEDEC international standard and have strong versatility.

2. Optimal product design can provide a variety of packaging ICs with protection while reducing transportation costs.

3. A variety of materials for customers to choose from to meet your ESD and process requirements.

4. Support for non-standard format customization.

5. BGA,QFN,QFP,PGA,TQFP,LQFP, SoC, SiP etc. All packaging methods are available. Can be customized based on customers' requirement (e.g, ESD property, Baking Temp, Baking Time).

6. The design of the structure and shape in line with Jedec international standards can also perfectly meet the requirements of the carrying components or IC of the tray, carrying function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, and improve work efficiency.

Application:

Package IC, PCBA module component, Electronic component packaging, Optical device packaging.

Technical Parameters:

Brand	Hiner-pack	Outline Line Size	322.6135.97.62mm
Model	HN1876	Cavity Size	2.9X4.1X2.7mm
Package Type	IC	Size	Customizable
Material	PC	Flatness	MAX 0.76mm
Resistance	1.0x10e4-1.0x10e11Ω	Service	Accept OEM, ODM
Color	Yellow	Certificate	RoHS

Material	Bake Temperature	Surface Resistance
PPE	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Carbon Powder	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
MPPO+Glass Fiber	Bake 125°C~Max 150°C	1.010E4Ω~1.010E11Ω
PEI+Carbon Fiber	Max 180°C	1.010E4Ω~1.010E11Ω
IDP Color	85°C	1.010E6Ω~1.010E10Ω
Color, temperature, and other special requirements can be customized

FAQ:

1. How can I get a quotation?
Reply: Please provide the details of your requirements as clearly as possible. So we can send you the offer for the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / WhatsApp, in case of any delays.

2. How long will it take to get a response?
Reply: We will reply to you within 24 hours of the working day.

3. What kind of service do we provide?
Reply: We can design IC Tray drawings in advance based on your clear description of the IC or component. Provide one-stop service from design to packaging and shipping.
4. What are your terms of delivery?
Reply: We accept EXW, FOB, CIF, DDU, DDP, etc. You can choose the one that is most convenient or cost-effective for you.

5. How to guarantee quality?
Reply: Our samples through strict testing, and the finished products comply with the international JEDEC standards, to ensure a 100% qualified rate.

DRAM IC ESD Component Tray For Electronics Parts Packing 1

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

DRAM IC ESD Component Tray For Electronics Parts Packing

DRAM IC ESD Component Tray For Electronics Parts Packing

IC ESD Component Tray

DRAM ESD Component Tray

IC esd tray

DRAM IC ESD Component Tray For Electronics Parts Packing

Features:

Application:

Technical Parameters:

FAQ: