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DRAM IC ESD Component Tray For Electronics Parts Packing

Certification
China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

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—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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DRAM IC ESD Component Tray For Electronics Parts Packing

DRAM IC ESD Component Tray For Electronics Parts Packing
DRAM IC ESD Component Tray For Electronics Parts Packing DRAM IC ESD Component Tray For Electronics Parts Packing DRAM IC ESD Component Tray For Electronics Parts Packing DRAM IC ESD Component Tray For Electronics Parts Packing

Large Image :  DRAM IC ESD Component Tray For Electronics Parts Packing

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN1876 Yellow
Payment & Shipping Terms:
Minimum Order Quantity: 500PCS
Price: $1.35~$2.38(Prices are determined according to different incoterms and quantities)
Packaging Details: 80~100pcs/per carton
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 2500PCS~3000PCS/per day

DRAM IC ESD Component Tray For Electronics Parts Packing

Description
Material: PC Color: Yellow
Temperature: 100°C Property: ESD
Surface Resistance: 1.0x10E4~1.0x10E11Ω Flatness: Less Than 0.76mm
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
Customized Service: Support Standard And Non-standard,precision Machining Injection Mold: Customized Case Need(Lead Time 25~30Days,Mold Life Span: 300,000 Times.)
High Light:

IC ESD Component Tray

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DRAM ESD Component Tray

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IC esd tray

DRAM IC ESD Component Tray For Electronics Parts Packing
 
ESD PC IC Trays With Different Cavities Can Be Customized For DRAM IC
 
 
Quick Detail
 
1. Designs conforms JEDEC international standard, and has strong versatility.
2. Optimal product design,can provide a variety of packaging IC with protection and while reducing transportation costs.
3. V type tray designs, with added protection for IC substrate edge ball placement.
4. A variety of materials for customers to choose from to meet your ESD and process requirements.
5. Support for non- standard format customization.
6. BGA,QFN,QFP,PGA,TQFP,LQFP, SoC SiP etc. All packaging methods are available. Can be customized based on customers requirement(e.g: ESD property, Baking Temp,Baking Time).
7.The design of the structure and shape in line with Jedec international standards can also perfectly meet the requirements of the carriing components or IC of the tray, carriing function to meet the requirements of the automatic feeding system, to achieve the modernization of loading, improve work efficiency.
 
Jedec Tray
Outline Line Size 322.6*135.9*7.62mm Brand Hiner-pack
Model HN1876 Package Type IC
Cavity Size 2.9X4.1X2.7mm Size Customized
Material PC Flatness MAX 0.76mm
Resistance 1.0x10e4-1.0x10e11Ω Service Accept OEM,ODM
Color Yellow Certificate ROHS
DRAM IC ESD Component Tray For Electronics Parts Packing 0
 

Product Application

 

Package IC PCBA module component

Electronic component packaging Optical device packaging

 


Packaging


Packaging Details:Packing according to customer's specified size

 
Material Bake Temperature Surface Resistance
PPE Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Carbon Powder Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
MPPO+Glass Fiber Bake 125°C~Max 150°C 1.0*10E4Ω~1.0*10E11Ω
PEI+Carbon Fiber Max 180°C 1.0*10E4Ω~1.0*10E11Ω
IDP Color 85°C 1.0*10E6Ω~1.0*10E10Ω
Color, temperature and other special requirements can be customized

FAQ


1. How can I get a quotation?
Reply:Please provide the details of your requirements as clear as possible. So we can send you the offer at the first time.
For purchasing or further discussion, it is better to contact us with Skype / Email / Phone / Whatsapp, in case of any delays.

2. How long will it take to get a response?
Reply:We will reply to you within 24 hours of working day.

3. What kind of service we provide?
Reply:We can design IC Tray drawings in advance based on your clear description of the IC or component.Provide one-stop service from design to packaging and shipping.
4. What is your terms of delivery?
Reply:We accept EXW,FOB,CIF,DDU,DDP etc. You can choose the one which is the most convenient or cost effective for you.

5. How to guarantee quality?
Reply:Our samples through strict testing, the finished products comply with the international JEDEC standards, to ensure 100% qualified rate.

DRAM IC ESD Component Tray For Electronics Parts Packing 1

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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