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Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry

Wafer Bare Die Tray Packaging For Electronics Semiconductor Industry

Brand Name: Hiner-pack
Model Number: HN2079
MOQ: 1000 pcs
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Payment Terms: T/T
Supply Ability: 4000PCS~5000PCS/per day
Detail Information
Place of Origin:
Made In China
Certification:
ISO 9001 ROHS SGS
Material:
ABS
Color:
Black
Property:
ESD
Design:
Standard
Size:
2 Inch
Surface Resistance:
1.0x10E4~1.0x10E11Ω
Clean Class:
General And Ultrasonic Cleaning
Incoterms:
EXW,FOB,CIF,DDU,DDP
Injection Mold:
Lead Time 20~25Days, Mold Life Span: 30~450,000 Times
Molding Method:
Injection Moulding
Packaging Details:
It depends on the QTY of order and size of product
Supply Ability:
4000PCS~5000PCS/per day
Highlight:

Wafer Tray Packaging Electronics

,

ESD Wafer Bare Die Tray

,

CSP Tray Packaging Electronics

Product Description

Wafer Bare Die Tray Packaging  For Electronics Semiconductor Industry

IC Packaging delivery systems for protecting and transporting bare die, CSP, ... die (KGD), chip scale packaging (CSP), and wafer scale packaging (WSP).


An anti-static tray is an ideal tool for storing electronic components. Due to the addition of special polymer chains in the raw material, the finished product has permanent electrostatic dissipation properties. The finished product has good mechanical strength and heat resistance. Good impact resistance and chemical corrosion resistance. It will not change its anti-static performance due to the environment, time, and temperature.


Hiner-pack production Waffle Pack (IC tray) is in line with international environmental standards, through the ROHS and SGS third party inspection, such as raw material of the raw material buying from domestic leading manufacturer, incoming inspection and related technology and strictly control the quality during production, quality department must confirm the product 100% qualified before shipment, are sold to domestic and international famous customers over the years, After the use of positive feedback, rich experience in injection molding industry also provides customers with the most appropriate packaging solutions.

Advantage:

1. More than 12 years of export experience

2. With professional engineers and efficient management

3. Short delivery time and good quality

4. Support small batch production in the first batch

5. Professional sales within 24 hours efficient reply

6. The factory has ISO certification, and the products comply with the RoHS standard.

7. Our products are exported to the United States, Germany, the UK, Korea, Japan, Israel, Malaysia, etc. won the praise of many customers, with service and cost performance being well recognized

Service:

1. We have sample stock, which can also help the client to choose which type is suitable for them.
2. We will reply to you at any time if you have questions.
3. Choose a suitable product for clients according to the clients' requirements.
4. After mold customization, free samples will be provided until the customer tests OK, to remove the quality concerns of customers before production.

Technical Parameters:

Brand Hiner-pack Outline Line Size 50.7*50.7*4mm
Model HN2079 Cavity Size 0.7*1.2*0.25mm
Package Type IC Parts Matrix QTY 10*10=100PCS
Material PC Flatness MAX 0.2mm
Color Black Service Accept OEM, ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate RoHS/SGS

waffle pack ic chip tray HN2079-1

FAQ:

Q: Can you do OEM and customized design IC trays?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase quantity of orders.
Q: Do you provide samples? Is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value, and all samples shipping costs are normally is by collected or as agreed.
Q: What kind of Incoterms can you do?
A: We could support doing Ex works, FOB, CNF, CIF, CFR, DDU, DAP, etc., and other incoterms as agreed.
Q: What method can you use to ship the goods?
A: By sea, by air, or by express, by mail, post, according to customer order quantity and volume.

waffle pack ic chip tray HN2079-2