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Optoelectronic Components Packaging Trays Bare Die

China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund


—— 本間宏紀

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—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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Optoelectronic Components Packaging Trays Bare Die

Optoelectronic Components Packaging Trays Bare Die
Optoelectronic Components Packaging Trays Bare Die Optoelectronic Components Packaging Trays Bare Die Optoelectronic Components Packaging Trays Bare Die Optoelectronic Components Packaging Trays Bare Die

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Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: To meet all kinds of custom needs of customers
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order and size of product
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 4000PCS~5000PCS/per day

Optoelectronic Components Packaging Trays Bare Die

Material: ABS.PC.PPE.MPPO...etc Color: Black.Red.Yellow.Green.White..etc
Property: ESD,Non-ESD Design: Standard And Non-standard
Size: All Kinds Of Surface Resistance: 1.0x10E4~1.0x10E11Ω
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
Injection Mold: Lead Time 20~25Days,Mold Life Span: 30~450,000 Times Molding Method: Injection Moulding
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Optoelectronic bare die tray

Optoelectronic Components Packaging Trays Bare Die


Durable Antistatic ABS Bare Die Tray With Different Size For Optoelectronic Components


Hiner pack designs trays for any type of component, module, MEMS, or device, and it need not be in a JEDEC format. Working with application requirements, engineering principles, materials technology, and manufacturing best practices, a custom solution may be the best value for your business.


Custom molded tray will develop a custom pocket design to handle and protect your sensitive and micro devices. Trays are then CNC machined to the specific configuration for your part.


As the tray in the field of optical application, more and more customers in order to protect components or optical devices, are willing to choose injection molding tray for packaging solution, because the tray can carrier component also provides comprehensive protection to transit and transport provides great convenience, all kinds of specifications and various color can be realized,Provide one-stop service from design to production to packaging.


HN2069 Technical Data Ref.
Base Information Material Color Matrix QTY Pocket Size
PC Black 10*10=100PCS 1.4*1.4*0.26mm
Size Length * Width * Height (according to customer's requirement)
Feature Durable;Reusable;Rcofriendly;Biodegradable
Sample A. The free samples: choosen from existing products.
B. customized samples as per your design/demand
Accessory Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format PDF,2D,3D


Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products


Product Application


Wafer Die / Bar / Chips                     PCBA module component

Electronic component packaging      Optical device packaging



Packaging Details:Packing according to customer's specified size




1. Flexible OEM service: we can produce products according to customer’s sample or design.

2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding,Production

4. Comprehensive customer service: from customer consultation to after sales service.

5. 10 years’ex perience of OEM for USA and EU customers.

6. We have our own factory and can control quality in high level and produce products quickly and flexibly.

Optoelectronic Components Packaging Trays Bare Die 0



Q1. Why Choose us?
Wallis insist strict QC during producing, product performance are ensured.
Strong technical team-quick to solve problems, creative to design new items, latest RFID items .
Big capacity-cost-effective and flexible to adjust production for volume and urgent orders.
10-year factory experienced in all crafts, and with strong customization capacity, satisfy your requirement to the best.
Having long-term and stable material suppliers, sources are trust-able and time-effective.
Owning professional agents of shipping. Goods reach to you fast, save and cost-effective.


Q2. Can I order if quantity less than MOQ?
Yes and it would be taken as sample order to production. We take more serious on sample order.

Q3. Can I get Free Samples?
Yes, If samples we have in stock would be provided for testing, but shipment should at your side.
If samples are needed to customize with your logo and designs, please send us designs and advise chip, quantity, and any other details required. Thank you.


Q4. Do you arrange shipment for the products?

It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

Optoelectronic Components Packaging Trays Bare Die 1

Optoelectronic Components Packaging Trays Bare Die 2

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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