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Product Details:
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| Material: | ABS.PC.PPE.MPPO...etc | Color: | Black.Red.Yellow.Green.White..etc |
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| Property: | ESD | Design: | Standard |
| Size: | 2 Inch | Surface Resistance: | 1.0x10E4~1.0x10E11Ω |
| Clean Class: | General And Ultrasonic Cleaning | Incoterms: | EXW,FOB,CIF,DDU,DDP |
| Injection Mold: | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times | Molding Method: | Injection Moulding |
| Highlight: | Waffle Pack IC Chip Tray,Waffle IC Chip Tray,ic waffle pack tray |
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2 Inch Waffle Pack IC Chip Tray
Durable Antistatic Waffle Pack With Different Size Can Be Customized For Wafer Bare
High temperature tray is IC tray, IC tray is semiconductor chip enterprises for its chips for packaging and baking test carrier. Because it can be in 120℃-220℃bake environment without deformation characteristics, so the electronic waste industry commonly known as "high temperature plate"
Antistatic plastic tray can eliminate static electricity, a large number of electronic devices and products in the production process of turnover loading, packaging, storage and transportation. The finished product has good mechanical strength and heat resistance; Good impact resistance and chemical corrosion resistance. It will not change its anti-static performance due to the environment, time and temperature. It is mainly used in the electronic product industry.
Advantages
1. Light weight, saving transportation and packaging costs;
2. Size specification, compatible in any 2 ", 3 "or 4" Waffle Pack Feeder Machine;
3. Good anti-static performance, effectively ensure that the product is not damaged by anti-static release;
4. High temperature resistance, suitable for high temperature automation equipment assembly;
5. Corrosion resistance, suitable for all kinds of production conditions of products;
6. Matrix arrangement design, under the premise of protecting the product, the most dozen capacity design, cost saving;
7. Edge chamfer design, effectively prevent stacking error, correct the direction of placement
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
| Outline Line Size | 50.7*50.7*4mm | Brand | Hiner-pack |
| Model | HN2078 | Package Type | Die |
| Cavity Size | 4.83*3.94*0.65 mm | Matrix QTY | 10*8=80PCS |
| Material | PC | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS |
Application
Semiconductor Wafer Die Wafter Bare, Electronic components, optical electronic components, etc
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
