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ESD Black Waffle Pack IC Chip Tray Anti Static For Mirco Die

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China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
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I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

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Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

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ESD Black Waffle Pack IC Chip Tray Anti Static For Mirco Die

ESD Black Waffle Pack IC Chip Tray Anti Static For Mirco Die
ESD Black Waffle Pack IC Chip Tray Anti Static For Mirco Die ESD Black Waffle Pack IC Chip Tray Anti Static For Mirco Die ESD Black Waffle Pack IC Chip Tray Anti Static For Mirco Die ESD Black Waffle Pack IC Chip Tray Anti Static For Mirco Die

Large Image :  ESD Black Waffle Pack IC Chip Tray Anti Static For Mirco Die

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN21070
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order and size of product
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: The capacity is between 4000PCS~5000PCS/per day

ESD Black Waffle Pack IC Chip Tray Anti Static For Mirco Die

Description
Material: PC Color: Black
Property: ESD Design: Non-standard
Surface Resistance: 1.0x10E4~1.0x10E11Ω Clean Class: General And Ultrasonic Cleaning
Injection Mold: Lead Time 20~25Days,Mold Life Span: 30~450,000 Times Molding Method: Injection Moulding
High Light:

Waffle Pack IC Chip Tray

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ESD Black IC Chip Tray

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Waffle Pack esd tray

ESD Black Waffle Pack IC Chip Tray Anti Static For Mirco Die

 

Waffle Pack Chip Tray Series Products For Mirco Die

 

Anti-static tray can effectively release the static charge accumulated on the surface of the object, so that it will not produce charge accumulation and high potential difference, so it can greatly reduce the damage rate of electronic products in the production process, reduce costs, improve product quality and profit.

 

For electronic products in the process of transportation and packing unavoidably will produce some friction, from the perspective of physics, friction causes electrostatic generation, and the temperature change in the weather outside, and will produce static electricity, the electrostatic if stay in electronic products, it is easy to cause a short-circuit damage to the precision of electronic products,In order to avoid this situation so its packaging materials require the use of good anti-static function of the pallet or packaging solutions

 

Reference Detail

 

Outline Size 50.7*50.7*4mm Brand Hiner-pack
Model HN21063 Package Type N/A
Cavity Size 1.2*0.9*0.8mm Matrix QTY 20*22=440PCS
Material ABS Flatness MAX 0.2mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS SGS
Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

ESD Black Waffle Pack IC Chip Tray Anti Static For Mirco Die 0

Application of ESD Tray

 

1. Semiconductor

2. Electronic component factories

3. SMT Surfacing factories

4. Optical industry

5. Military Industry

 

Advantage

 

1. Have exported for more than 10 years
2. Have professional engineer and efficient management
3. Delivery time is short, normally in stock
4. Small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to USA, Germany, UK, Europe, Korea, Japan...etc, Win many big famous customer reputation.
7. Factory have ISO certificate, Product comply to Rohs standard.

 

FAQ

 

Q1: Are You Manufacturer or Trade Company?

We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.

Q2: What is the material of your product?

ABS.PC.PPE.MPPO.PEI.HIPS...etc

Q3: Can you help with the design?

Yes, we can accept your customization and do the packaging for you according to your requirement.

Q4: How can I get the quotation of the custom products ?

Let us know the size of your IC or component thickness,and then we can make a quotation for you.

Q5: Can I get some samples before making a bulk order?

Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.

Q6: Could you put my logo in our product?
Yes, we can put your logo in our product, show us your logo firstly please.

Q7: When can we get the samples?
We can send you them right now if you are interested in something we have stock, and customize

the project depending on the specific time.

ESD Black Waffle Pack IC Chip Tray Anti Static For Mirco Die 1ESD Black Waffle Pack IC Chip Tray Anti Static For Mirco Die 2

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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