High Cleanliness Waffle Pack Chip Trays 4 Inch For Small Bare Die

High Cleanliness Waffle Pack Chip Tray For Small Bare Die

Waffle pack is widely used in semiconductor, photoelectric industry customers of the product requires a high degree of cleanliness and size, we from the design drawings, mold manufacturing, product manufacturing to cleaning packing and so on, all of the steps and operations through strict quality control, to deliver the ultimate goal of customer satisfaction for product, continuously meet the customer's requirements, To promote our factory to a higher level of progress.

The HN21076 Waffle Pack Opening Procedure

1. Holding the clip with one hand, use the thumb of one hand and thumb and fingers of the other hand to slide the waffle “tray" and the lid out of the clip without allowing the tray and lid to separate. JTI recommends using gloves when opening discrete device packaging.

2. Carefully slide the tray and lid onto a flat surface without allowing the tray and lid to separate. The work area should have static reduction measures in place such as a grounded, dissipative work surface and ionizing fans. It should be free of strong drafts, particularly for parts smaller than 20 mil X20 mil (0.5 X0.5mm).

3. Hold down two diagonal corners with one hand to keep the lid securely on top of the tray and use tweezers or another small tool to gently tap the lid at the two exposed corners and the center of the lid. This should cause any parts that may be stuck to the insert to fall back into the cavity.

4. Carefully lift the lid straight up to remove from the tray, turn the lid upside down and place it on the flat surface next to the tray.

Advantage

1. Have exported for more than 10 years
2. Have professional engineer and efficient management
3. Delivery time is short, normally in stock
4. Small quantity is allowed.
5. The best & professional sale services, 24hours Response.
6. Our products have been exported to USA, Germany, UK, Europe, Korea, Japan...etc, Win many big famous customer reputation.
7. Factory have ISO certificate, Product comply to Rohs standard.

Product Application Of Chip Tray

Electronic component       Semiconductor

Embedded System            Display technology

FAQ

Q1. Do your products get any certificates?
Ans: Yes, CE for EU market, FDA for USA market.
Q2.Can you do the design for us?
Ans:Yes.,we have a professional team having rich experience in designing and manufacturing. Just tell us your ideas and we will help to carry out your ideas into perfect fact. It does not matter if you do not have some one to complete files. Send us high resolution images, your logo and text and tell us how you would like to arrange them. We will send you finished files for confirmation.
Q3. How long is the delivery time?
Ans:For standard machine, it would be 5-7Working days. For non-standard/customized machines according to clients' specific requirements, It would be 20~25 working days.
Q4. Do you arrange shipment for the products?

Ans:It’s depends on our incoterms,If FOB or CIF price, we will arrange shipment for you, but EXW price, clients need to arrange shipment by themselves or their agents.

Q5. How about the documents after shipment?
Ans:After shipment, we'll send all original documents to you by DHL, including Commercial Invoice, Packing List, B/L and other certificates as required by clients.