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Product Details:
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| Material: | ABS | Color: | Black |
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| Flatness: | MAX 0.2mm | Design: | Non-standard |
| Surface Resistance: | 1.0x10E4~1.0x10E11Ω | Clean Class: | General And Ultrasonic Cleaning |
| Injection Mold: | Lead Time 20~25Days,Mold Life Span: 30~450,000 Times | Use: | Transport,Storage,Packing |
| High Light: | MAX 0.2mm Waffle Pack Chip Trays,PC Material Waffle Pack Chip Trays,Optical Device IC Chip Tray |
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Black ABS Waffle Pack Chip Tray for Optical Device
The Waffle Pack is widely used in semiconductor, photoelectric industry. The product requires a high degree of cleanliness and size. From the design drawings, mold manufacturing, product manufacturing to cleaning packing , all of the steps and operations through strict quality control. To deliver the ultimate goal of customer satisfaction for product, our company continuously meet the customer's requirements and promote our factory to a higher level of progress.
1.Details about The HN21093 Black ABS Waffle Pack Chip Tray for Optical Device
The HN21093 Waffle Pack is a tray made of industrial plastics. The raw material can be recycled, and it is easy to be degraded after waste. There is no concern about environmental protection. It is small in size, light in weight and low in transportation cost.
At the same time, the 20*20 matrix can hold a large number of products, which is suitable for transfer or loading sample testing. The Hiner-pack also produces covers and clamps ,which are suitable for fastening and transporting all kinds of waffle packs.
| Outline Line Size | 50.7*50.7*4mm | Brand | Hiner-pack |
| Model | HN21093 | Package Type | Bare Die |
| Cavity Size | 0.95*1.25*0.46 | Matrix QTY | 20*20=400PCS |
| Material | ABS | Flatness | MAX 0.2mm |
| Color | Black | Service | Accept OEM,ODM |
| Resistance | 1.0x10e4-1.0x10e11Ω | Certificate | ROHS SGS |
2.Product Application
Optical device packaging Electrical equipment and systems
Electronic component packaging Wafer Die / Bare / Chips
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
3.Advantages
1. Flexible OEM service: we can produce products according to customer’s sample or design.
2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.
3. Complicated workmanship: tooling making, Injection molding,Production.
4. Comprehensive customer service: from customer consultation to after sales service.
5. 10 years experience of OEM for USA and EU customers.
6. We have our own factory and can control quality in high level and produce products quickly and flexibly.
4.FAQ
Q1: Are You Manufacturer or Trade Company?
We are the 100% Manufacturer specialized in packaging over 10 years with 1500 square meters workshop area, located in Shenzhen China.
Q2: What is the material of your product?
ABS.PC.PPE.MPPO.PEI.HIPS...etc
Q3: Can you help with the design?
Yes, we can accept your customization and do the packaging for you according to your requirement.
Q4: How can I get the quotation of the custom products ?
Let us know the size of your IC or component thickness,and then we can make a quotation for you.
Q5: Can I get some samples before making a bulk order?
Yes, the fee sample in stock can be sent, but the shipping fee should be paid by yourself.
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
