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Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used For Electronic Modules And Chips

Name: Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used For Electronic Modules And Chips
Brand: Shenzhen Hiner Technology Co.,LTD
SKU: HN23047
Price: 0.35 USD
Availability: InStock

Brand Name:	Hiner-pack
Model Number:	HN23047
MOQ:	1000
Price:	TBC
Payment Terms:	100% Prepayment
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ISO 9001 SGS ROHS

Eco-Friendly:

Yes

Anti-Static:

1.0*10E4~1.0*10E11Ω

Warpage:

2 Inch >0.2mm 4 Inch>0.3mm

Matrix Qty:

TBC

Chemical Resistant:

In Line With JEDEC International Standards, Strong Versatility.

Reusable:

Yes

Clean Class:

General And Ultrasonic Cleaning

Design:

Chamfer

Packaging Details:

500 pcs/carton(According to actual packing）

Supply Ability:

2000PCS/Day

Highlight:

Electronic Modules IC Chip Tray

Standard Size IC Chip Tray

4 Inch ESD Waffle Pack

Product Description

Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used For Electronic Modules And Chips

Ensure safe transit and storage of microelectronic components with anti-static waffle packs built to your device dimensions.

A chip tray is a specialized container used for storing, transporting, and processing semiconductor chips (such as silicon wafers).
It is usually made of anti-static materials to prevent static electricity from damaging the chip.
The design of the waffle pack aims to protect chips and ensure that they are not physically damaged or contaminated during production, testing, and transportation.

Technical Parameters:

Product Name	Waffle Pack/IC Chip Tray
External Dimension	101.6x101.6x10.5mm
Matrix Qty	5X7=35PCS
MOQ	1000pcs
Place of Origin	China
Delivery Time	1-2 weeks

Applications:

Semiconductor manufacturing: In the semiconductor production process, chip trays (Waffle Pack) are used to store and transport silicon wafers, ensuring safety during the processing and testing stages.
Packaging and assembly: During the chip packaging and assembly process, a chip tray (Waffle Pack) helps maintain the neatness and safety of the chips, reducing the risk of damage.
Automation equipment: Used in conjunction with automated production equipment to ensure accurate positioning and processing of chips during the automation process.

Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used For Electronic Modules And Chips 0

Features:

Stackability: Stackable design facilitates storage and transportation, saves space, and improves management efficiency.
Lightweight: Lightweight design, easy to operate and transport, suitable for laboratory and small batch production.
High-precision: Accurate mold manufacturing ensures stable fixation of chips, reducing displacement and collision risks.

Support and Services:

Customized design: Provide customized chip tray designs based on customer-specific needs, including dimensions, shapes, and materials.
Quality inspection: Strict quality control and testing are carried out on chip disks to ensure that each product meets industry standards.
Technical Support: Provide technical consultation and support to help customers choose suitable chip disks and solve problems during use.

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Address

Building A11, Zone D, West Industrial Zone, Minzhu Community, Shajing Street, Baoan District, Shenzhen City, GD Province CN

Tel

86-0755-23229236-816

E-mail

Rainbowzhu@hiner-pack.com

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Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used For Electronic Modules And Chips

Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used For Electronic Modules And Chips

Electronic Modules IC Chip Tray

Standard Size IC Chip Tray

4 Inch ESD Waffle Pack

Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used For Electronic Modules And Chips

Technical Parameters:

Applications:

Features:

Support and Services: