logo
products
Home / Products / IC Chip Tray /

Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used For Electronic Modules And Chips

Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used For Electronic Modules And Chips

Brand Name: Hiner-pack
Model Number: HN23047
MOQ: 1000
Price: TBC
Payment Terms: 100% Prepayment
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ISO 9001 SGS ROHS
Eco-Friendly:
Yes
Anti-Static:
1.0*10E4~1.0*10E11Ω
Warpage:
2 Inch >0.2mm 4 Inch>0.3mm
Matrix Qty:
TBC
Chemical Resistant:
In Line With JEDEC International Standards, Strong Versatility.
Reusable:
Yes
Clean Class:
General And Ultrasonic Cleaning
Design:
Chamfer
Packaging Details:
500 pcs/carton(According to actual packing)
Supply Ability:
2000PCS/Day
Highlight:

Electronic Modules IC Chip Tray

,

Standard Size IC Chip Tray

,

4 Inch ESD Waffle Pack

Product Description

Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used  For Electronic Modules And Chips

Ensure safe transit and storage of microelectronic components with anti-static waffle packs built to your device dimensions.

  • A chip tray is a specialized container used for storing, transporting, and processing semiconductor chips (such as silicon wafers).
  • It is usually made of anti-static materials to prevent static electricity from damaging the chip.
  • The design of the waffle pack aims to protect chips and ensure that they are not physically damaged or contaminated during production, testing, and transportation.

Technical Parameters:

Product Name Waffle Pack/IC Chip Tray
External Dimension 101.6x101.6x10.5mm
Matrix Qty 5X7=35PCS
MOQ 1000pcs
Place of Origin China
Delivery Time 1-2 weeks

Applications:

  • Semiconductor manufacturing: In the semiconductor production process, chip trays (Waffle Pack) are used to store and transport silicon wafers, ensuring safety during the processing and testing stages.
  • Packaging and assembly: During the chip packaging and assembly process, a chip tray (Waffle Pack) helps maintain the neatness and safety of the chips, reducing the risk of damage.
  • Automation equipment: Used in conjunction with automated production equipment to ensure accurate positioning and processing of chips during the automation process.

Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used  For Electronic Modules And Chips 0

Features:

  • Stackability: Stackable design facilitates storage and transportation, saves space, and improves management efficiency.
  • Lightweight: Lightweight design, easy to operate and transport, suitable for laboratory and small batch production.
  • High-precision: Accurate mold manufacturing ensures stable fixation of chips, reducing displacement and collision risks.
Standard Size IC Chip Tray 4 Inch ESD Waffle Pack Used  For Electronic Modules And Chips 1

Support and Services:

  • Customized design: Provide customized chip tray designs based on customer-specific needs, including dimensions, shapes, and materials.
  • Quality inspection: Strict quality control and testing are carried out on chip disks to ensure that each product meets industry standards.
  • Technical Support: Provide technical consultation and support to help customers choose suitable chip disks and solve problems during use.