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Jedec IC Trays

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Home / Products / IC Chip Tray /

Anti-Static IC Chip Tray for General and Ultrasonic Cleaning Long Lasting 4 Inch Waffle Pack

Anti-Static IC Chip Tray for General and Ultrasonic Cleaning Long Lasting 4 Inch Waffle Pack

Anti-Static IC Chip Tray for General and Ultrasonic Cleaning Long Lasting 4 Inch Waffle Pack

Brand Name: Hiner-pack
Model Number: HN23064
MOQ: 1000
Price: TBC
Payment Terms: 100% Prepayment
Supply Ability: 2000PCS/Day
Detail Information
Product Description
Detail Information
Place of Origin:
China
Certification:
ISO 9001 SGS ROHS
Height:
Standard Size
Warpage:
2 Inch >0.2mm 4 Inch>0.3mm
Clean Class:
General And Ultrasonic Cleaning
Anti-Static:
1.0*10E4~1.0*10E11Ω
Reusable:
Yes
Eco-Friendly:
Yes
Design:
Chamfer
Temperature:
According To Product Material
Packaging Details:
500 pcs/carton(According to actual packing）
Supply Ability:
2000PCS/Day
Highlight:

Long Lasting IC Chip Tray

,

Anti-Static IC Chip Tray

,

Ultrasonic Cleaning IC Chip Tray

Product Description

Product Description:

  • The waffle packs are designed to be small, thin, and convenient to use. They offer a reliable way of protecting small parts during transportation, storage, and handling. The packs comprise a plastic base with a grid of regularly spaced cavities or pockets impressed on its surface. These pockets or cavities hold the small parts in place, keeping them organized and secure.

Technical Parameters:

 
Product Name Waffle pack/IC Chip Tray
Pocket Size 7.2*4.75*1.5mm
External Dimension 101.57x101.57x5.5mm
Matrix Qty 10X14=140PCS
MOQ 1000 pcs
Place of Origin China
Delivery Time 1-2 weeks

 

Applications:

  • Wafer Handling: Waffle packs are designed to securely store and transport silicon wafers during various manufacturing processes. Their design prevents movement and protects wafers from contamination and damage.
  • Die Packaging: After cutting wafers into individual dies, waffle packs are used to store and protect the Integrated Circuits (ICs) before they are mounted onto Printed Circuit Boards. This minimizes the risk of physical damage or contamination.
  • Transporting Tested Components: Components that have undergone functional testing are transported using waffle packs to ensure they remain clean and undamaged during transit to packaging lines or storage.

Anti-Static IC Chip Tray for General and Ultrasonic Cleaning Long Lasting 4 Inch Waffle Pack 0

Features:

  • Polystyrene: Rigid and clear, allowing visibility of components. Cost-effective and widely used in packaging; can be treated for anti-static properties.
  • Conductive Plastics: Made with carbon or metal additives to provide conductivity. These materials dissipate static electricity, further protecting sensitive components.
  • Thermoplastics: Can be easily molded and reshaped. Versatile for creating custom waffle pack designs that fit specific components.
Anti-Static IC Chip Tray for General and Ultrasonic Cleaning Long Lasting 4 Inch Waffle Pack 1

Support and Services:

  • 24/7 technical support hotline
  • Online technical support portal
  • Access to product manuals and documentation
  • Regular software updates and patches
  • On-site and remote technical support services
  • Product training and certification programs
  • Product repair and maintenance services
  • Product replacement and exchange programs

FAQ:

Q1: What is the brand name of this IC Chip Tray?

A1: The brand name of this IC Chip Tray is Hiner-pack.

Q2: Where is this IC Chip Tray made?

A2: This IC Chip Tray is made in China.

Q3: What is the minimum order quantity for this IC Chip Tray?

A3: The minimum order quantity for this IC Chip Tray is 1000.

Q4: What is the price of this IC Chip Tray?

A4: The price of this IC Chip Tray is to be confirmed.

Q5: What is the delivery time for this IC Chip Tray?

A5: The delivery time for this IC Chip Tray is 1~2 weeks.

Tags: 

Jedec IC Chip Tray  

RF Jedec Matrix Trays  

IC Jedec Matrix Trays

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