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4 Inch IC Chip Tray For High Durability And Eco-Friendly Used In Semiconductor Packaging Field

Brand Name:	Hiner-pack
Model Number:	HN23147
MOQ:	1000
Price:	TBC
Payment Terms:	100% Prepayment
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

China

Certification:

ISO 9001 SGS ROHS

Matrix Qty:

TBC

Reusable:

Yes

Anti-Static:

1.0*10E4~1.0*10E11Ω

Height:

Standard Size

Durable:

Yes

Temperature:

According To Product Material

Warpage:

2 Inch >0.2mm 4 Inch>0.3mm

Chemical Resistant:

In Line With JEDEC International Standards, Strong Versatility.

Packaging Details:

500 pcs/carton(According to actual packing）

Supply Ability:

2000PCS/Day

Highlight:

High Durability IC Chip Tray

Eco-Friendly IC Chip Tray

4 Inch IC Chip Tray

Product Description

Product Description:

• Waffle packs are a popular format for handling small parts and delicate microelectronics such as semiconductor die, photonics optics, and chip scale components. They are small, thin and incredibly convenient for small parts. Waffle packs are also well established and have become an unofficial standard format in the industry, just like JEDEC matrix trays.

Technical Parameters:

Brand Name	Hiner-pack
Pocket Size	4.015.751.6mm
External Dimension	101.6x101.6x4.57mm
Matrix Qty	11X14=154PCS
MOQ	1000PCS
Place of Origin	China

Applications:

Semiconductor Manufacturing:

Die Packaging: After cutting wafers into individual dies, waffle packs are employed to securely hold these ICs. This minimizes the risk of physical damage or contamination before they are mounted onto PCBs (Printed Circuit Boards).

Testing and Quality Control:

Transporting Tested Components: Once components are tested and confirmed to be functional, waffle packs are used to transport them to the packaging lines or storage. This ensures their cleanliness and preserves their integrity during transportation.

4 Inch IC Chip Tray For High Durability And Eco-Friendly Used In Semiconductor Packaging Field 0

Features:

High-Density Polyethylene (HDPE): This material offers good chemical resistance, durability, and is lightweight. It provides a non-contaminating surface, which makes it ideal for semiconductor applications.
Anti-Static Coated Materials: Various plastics can be treated with anti-static coatings to prevent electrostatic discharge (ESD). This property is essential for safeguarding sensitive electronic components during handling and transport.
Thermoplastics: This material can be easily molded and reshaped. It's versatile and commonly used for creating custom waffle pack designs that fit specific components.

4 Inch IC Chip Tray For High Durability And Eco-Friendly Used In Semiconductor Packaging Field 1

Support and Services:

Customization to meet specific requirements
Installation and setup assistance
Product training and education
Regular maintenance and updates

FAQ:

Q1: What is the brand name of this IC Chip Tray?

A1: The brand name of this IC Chip Tray is Hiner-pack.

Q2: What is the model number of this IC Chip Tray?

A2: The model number of this IC Chip Tray is Waffle Pack Series.

Q3: Where is this IC Chip Tray made?

A3: This IC Chip Tray is made in China.

Q4: Does this IC Chip Tray have any certification?

A4: Yes, this IC Chip Tray has ISO 9001, SGS, and ROHS certification.

Q5: What is the minimum order quantity for this IC Chip Tray?

A5: The minimum order quantity for this IC Chip Tray is 1000.

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4 Inch IC Chip Tray For High Durability And Eco-Friendly Used In Semiconductor Packaging Field

4 Inch IC Chip Tray For High Durability And Eco-Friendly Used In Semiconductor Packaging Field

High Durability IC Chip Tray

Eco-Friendly IC Chip Tray

4 Inch IC Chip Tray

Product Description:

Technical Parameters:

Applications:

Features:

Support and Services:

FAQ:

Jedec IC Chip Tray

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IC Jedec Matrix Trays

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OEM Black Anti Static Bare Die Trays 2 Inch Non Toxic RoHS Standard

2 Inch Square Portable Black Plastic IC Chip Tray For IC Devices

ABS Single QFP Waffle Pack Tray 5.5mm Thickness High Quality