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Anti-Static Bare Die Tray For Chip Scale Packages With High Temperature Resistance

Anti-Static Bare Die Tray For Chip Scale Packages With High Temperature Resistance

Brand Name: Hiner-pack
Model Number: HN24102
MOQ: 1000 Pcs
Price: $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 4000PCS~5000PCS/per Day
Detail Information
Place of Origin:
SHENZHEN CN
Certification:
ISO 9001 ROHS SGS
Design:
Original Sample Or We Can Create The Designs
Clean Class:
General And Ultrasonic Cleaning
Molding Method:
Injection Moulding
Injection Mold:
Lead Time 20~25 Days
Anti-Static:
Yes
Property:
ESD
Color:
Black (Customizable)
Warpage:
<0.3mm
Packaging Details:
It Depends On The QTY Of Order And Size Of Product
Supply Ability:
4000PCS~5000PCS/per Day
Highlight:

Chip Scale Packages Bare Die Tray

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Anti-Static Bare Die Tray

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High Temperature Resistance Bare Die Tray

Product Description

Product Description:

Bare Die Trays are highly sought after due to their compact size. They are particularly favored for small die, chip scale packages (CSP), and components of similar sizes. In situations where a standard JEDEC matrix tray would be too large, bare die trays offer a smaller yet equally protective option that is widely accepted in the industry.

When stacked, bare die trays create individual compartments that safeguard your parts. Their small dimensions also make them convenient for packaging and transportation purposes.

Bare die trays are well-suited for manual loading and unloading tasks, and there are commercial feeders available for automated processes. Additionally, we manufacture JEDEC matrix trays that can act as "adaptors" to accommodate bare die trays in JEDEC tray feeders and handlers.

Features:

  • Trays are made using top-quality materials like conductive plastics and non-conductive polymers, which help prevent ESD damage and ensure durability. These trays are customized to fit specific dimensions for each bare die size, protecting them from common ESD hazards found in the semiconductor industry.
  • The tray's pocket assists in shaping it to securely hold the bare dies without any movement or damage during use.
  • Die trays are designed for a wide range of die sizes, from small microchip dimensions to large integrated circuits. Each tray design caters to the diverse facets and innovative requirements of the industry.
  • Protective casings are crucial for semiconductor manufacturing and assembly processes, providing individual bare die protection during transport and storage. These trays are stackable to optimize space utilization, with the ability to conveniently store them in corners. Moreover, their design enhances storage utility and reduces the chances of loss or misplacement.

Technical Parameters:

HN24102 Technical Data Ref.
Base Information Material Color Matrix QTY Pocket Size
PC Black 2+5=7PCS 13.35*48.6*0.1mm
Size Length * Width * Height (according to customer's requirement)
Feature Durable;Reusable;Rcofriendly;Biodegradable
Sample A. The free samples: Choosen from existing products.
B.  Customized samples as per your design/demand
Accessory Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format PDF,2D,3D
Anti-Static Bare Die Tray For Chip Scale Packages With High Temperature Resistance 0

Customization:

Our custom bare die trays are tailored to fit your specific requirements.

We offer trays molded from materials selected to meet your needs, with customizable features such as:

  • component support
  • temperature ratings
  • color choices
  • engraving options
  • reference marks
  • fiducials
  • special sizes or thicknesses
Anti-Static Bare Die Tray For Chip Scale Packages With High Temperature Resistance 1