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Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components

Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components

Brand Name: Hiner-pack
Model Number: HN24122
MOQ: 1000 Pcs
Price: $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 4000PCS~5000PCS/per Day
Detail Information
Place of Origin:
SHENZHEN CN
Certification:
ISO 9001 ROHS SGS
Surface Resistance:
1.0x10E4~1.0x10E11Ω
Injection Mold:
Lead Time 20~25 Days
Clean Class:
General And Ultrasonic Cleaning
Molding Method:
Injection Moulding
Property:
ESD
Anti-Static:
Yes
Stackable:
Yes
Customizable:
Yes
Packaging Details:
It Depends On The QTY Of Order And Size Of Product
Supply Ability:
4000PCS~5000PCS/per Day
Highlight:

ESD Protection Bare Die Trays

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Waffle Box Design Bare Die Trays

Product Description

Product Description:

Bare Die Trays are a preferred option due to their compact size. For small die, chip scale packages (CSP), and similar-sized components, when a full-size JEDEC matrix tray would be too bulky, bare die trays provide comparable industry acceptance and component protection in a more space-efficient form.

Bare die trays can be stacked to create protective compartments for your parts. Their small size makes them easy to package and transport efficiently.

These trays are favored for manual loading and unloading, and there are also commercial feeders available. In addition, we design JEDEC matrix trays that can function as "adaptors" for processing bare die trays through JEDEC tray feeders and handlers.

Features:

  • Trays are made from premium materials like conductive plastics and non-conductive polymers to prevent ESD damage and ensure durability, particularly safeguarding bare dies from common hazards in the semiconductor industry. Each tray is customized to specific dimensions to accommodate different bare die sizes.
  • The tray's pocket securely holds the dies in place, reducing the risk of motion or damage while in use.
  • Die trays are designed for a wide range of die sizes, from small microchips to large integrated circuits. Various tray designs cater to the diverse needs and innovative requirements in the industry.
  • Protective casings are crucial in semiconductor manufacturing and assembly processes, providing individual bare die protection during transportation or storage. They are also stackable to optimize space efficiency. Stacked trays can be conveniently stored in a corner, minimizing the risk of loss or misplacement.

Technical Parameters:

HN24122 Technical Data Ref.
Base Information Material Color Matrix QTY Pocket Size
ABS Black 15*18=270PCS 3.92*3.02*1.10mm
Size Length * Width * Height (according to customer's requirement)
Feature Durable;Reusable;Rcofriendly;Biodegradable
Sample A. The free samples: Chosen from existing products.
B.  Customized samples as per your design/demand
Accessory Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format PDF,2D,3D
Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components 0

Customization:

Unlike standard bare die trays typically found in catalogs or on distributor shelves, we produce custom bare die trays tailored to the specific dimensions of your components. The trays are molded from materials chosen to meet your requirements and feature custom options like component support features, temperature rating, color choices, engraving, reference marks, and fiducial, as well as variations in size or thickness.

Waffle Box Design ESD Protection Bare Die Trays For Small-Sized Chip Components 1