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Compact Grid Tray for Bare Die Storage in Semiconductor Facilities

Compact Grid Tray for Bare Die Storage in Semiconductor Facilities

Brand Name: Hiner-pack
Model Number: HN24024
MOQ: 1000 Pcs
Price: $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 4000PCS~5000PCS/per Day
Detail Information
Certification:
ISO9001, ROHS, SGS
Size:
2-inch
Warpage:
<0.2mm
Temperature:
80°C~180°C
Surface Resistance:
1.0x10E4~1.0x10E11Ω
Color:
Black, Red, Yellow, Green, White...etc.
Material:
ABS, PC, PPE, MPPO...etc.
Injection Mold:
Lead Time 20~25 Days
Packaging Details:
It Depends On The QTY Of Order And Size Of Product
Supply Ability:
4000PCS~5000PCS/per Day
Product Description

Compact Grid Tray for Bare Die Storage in Semiconductor Facilities

Bare Die Trays Overview 

Bare Die Trays, also known as waffle pack trays, are slim trays typically measuring 2” or 4” square. These trays feature a uniform arrangement of separator ribs, creating distinct pockets that give them the appearance of a waffle.

Utilization of Waffle Pack Chip Trays

Waffle pack chip trays serve as essential tools for managing and transporting bare dies or chip scale packages (CSP). These trays commonly come equipped with uncomplicated rectangular pockets. In instances where specific requirements such as bakeable materials or customized pocket geometry are essential, customized waffle pack trays are widely favored.

Features:

1. ESD Protection: These die trays are meticulously designed to ensure that the materials utilized have the capability to absorb all electrostatic discharge (ESD) generated during the handling and transportation of dies.

2. Temperature Friendly: The die trays are suitable for a wide temperature range, allowing for easy handling of dies as they transition between different processes. This feature guarantees the optimal temperature environment for the placement of the dies.

3. Clean Room Certified: The die trays are certified for clean room usage, ensuring a 100% contaminant-free environment. This certification is vital as the trays effectively mitigate electric shocks that could potentially damage the dies.

4. Versatile Compatibility:  These trays come in various die sizes and are engineered to be compatible with all types of dies, catering to the preferences and requirements of users.

Technical Parameters:

HN24024 Technical Data Ref.
Base Information Material Color Matrix QTY Pocket Size
ABS Black 16*16=256PCS 1.65*1.65*0.8mm
Size Length * Width * Height (according to customer's requirement)
Feature Durable; Reusable; Rcofriendly; Biodegradable
Sample A. The free samples: Choosen from existing products.
B.  Customized samples as per your design/demand
Accessory Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format PDF,2D,3D
Compact Grid Tray for Bare Die Storage in Semiconductor Facilities 0

Applications:

The die tray plays a crucial role in semiconductor manufacturing and assembly. It serves as a primary tool for transporting semiconductor dies between production centers within the industry. Furthermore, die trays are essential for securely holding the dies during testing procedures and for safe storage purposes.

In addition to its transportation and storage functions, die trays are also employed as a protective measure for delicate semiconductor dies during testing phases. Their availability in various semiconductor research organizations, as well as stores and production facilities, ensures easy access and utilization within the industry.

Die trays are primarily designed and used for the efficient transportation and testing of prototype semiconductor dies, reflecting their significant role in the development and production of semiconductor technologies.

Compact Grid Tray for Bare Die Storage in Semiconductor Facilities 1