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Durable 2-inch Chip Tray With ESD Protection For Microelectronics

Brand Name:	Hiner-pack
Model Number:	HN24022
MOQ:	1000 Pcs
Price:	$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	4000PCS~5000PCS/per Day

Detail Information

Product Description

Detail Information

Certification:

ISO9001, ROHS, SGS

Use:

Transport, Storage, Packing

Incoterms:

EXW, FOB, CIF, DDU, DDP

Color:

Black, Red, Yellow, Green, White...etc.

Durability:

Sturdy And Impact-Resistant

Customized Service:

Support Standard And Non-standard, Precision Machining

Warpage:

＜0.2mm

Temperature:

80°C~180°C

Packaging Details:

It Depends On The QTY Of Order And Size Of Product

Supply Ability:

4000PCS~5000PCS/per Day

Product Description

Durable 2-inch Chip Tray With ESD Protection For Microelectronics

Waffle packs, also known as waffle pack trays, are typically thin trays measuring 2” or 4” square. They feature a regular pattern of separator ribs that give them the appearance of a waffle.

These waffle pack chip trays are commonly employed for managing and transporting bare die or chip scale packages (CSP). They usually come with straightforward rectangular pockets. For scenarios where specific requirements are essential, such as the need for bakeable material or unique pocket geometry, custom waffle pack trays are favored.

Features:

These products are specifically designed with the consideration that the materials utilized can absorb all electrostatic discharge (ESD) generated during the handling and transportation of dies.

The temperature versatility of these items allows for easy handling of dies as they move between different processes. This feature ensures that the dies are maintained within the ideal temperature range for their placement.

The die trays are officially certified for use in a clean room environment that is completely free from contaminants. This is due to their ability to neutralize the electric shock that can potentially damage the dies during handling.

These trays come in various sizes suitable for all types of dies, and they are universally compatible with different die varieties, catering to the preferences of the user.

Technical Parameters:

HN24022 Technical Data Ref.
Base Information	Material	Color	Matrix QTY	Pocket Size
	ABS	Black	8*10=80PCS	4.453.150.83mm
Size	Length * Width * Height (according to customer's requirement)
Feature	Durable; Reusable; Rcofriendly; Biodegradable
Sample	A. The free samples: Choosen from existing products.
	B. Customized samples as per your design/demand
Accessory	Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format	PDF,2D,3D

Applications:

The die tray plays a crucial role in the production and assembly of semiconductor dies. Specifically, it serves as a common bridge for semiconductor companies to facilitate the transportation of dies between different production centers.

Besides its transportation function, die trays are also utilized as a means of securing the dies during testing and for storage purposes.

Die trays are readily available in most semiconductor research associations, stores, and production units. They are essential tools primarily used for handling and testing prototype semiconductor dies.

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Durable 2-inch Chip Tray With ESD Protection For Microelectronics

Durable 2-inch Chip Tray With ESD Protection For Microelectronics

Features:

Technical Parameters:

Applications:

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