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Secure Packaging Solution ABS Bare Die Tray With Optional Lid And Clip

Secure Packaging Solution ABS Bare Die Tray With Optional Lid And Clip

Brand Name: Hiner-pack
Model Number: HN24036
MOQ: 1000 Pcs
Price: $0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 4000PCS~5000PCS/per Day
Detail Information
Certification:
ISO 9001 ROHS SGS
Size:
2-inch (4-inch Optional)
Heat Resistant:
Yes
Custom Logo:
Available
Lid And Clip:
Optional
Material:
ABS, PC, PPE, MPPO, PEI, HIPS...etc.
Clean Class:
General And Ultrasonic Cleaning
Injection Mold:
Lead Time 20~25 Days
Packaging Details:
It Depends On The QTY Of Order And Size Of Product
Supply Ability:
4000PCS~5000PCS/per Day
Product Description

Secure Packaging Solution ABS Bare Die Tray With Optional Lid And Clip

The Bare Die Tray (Chip Tray & Waffle Pack) series from Hiner-pack provides a safe and convenient solution for packaging and transporting various microelectronic components such as Chip, Die, COG, and Optoelectronic devices. These products come in multiple sizes and materials, with options including 2-inch and 4-inch product specifications. Materials used include Antistatic/Conductive ABS and PC, offering flexibility for different needs. Additionally, customization is available to meet the specific requirements of customers.

Features:

Molded of ESD-safe, non-sloughing, carbon-powder-free, clean polymers

This product is manufactured using ESD-safe, non-sloughing, carbon-powder-free, clean polymers. These materials are carefully selected to ensure safety against electrostatic discharge (ESD) while also being environmentally friendly and free of carbon powder residue.

Carbon-fiber reinforced for strength and permanent ESD protection

In addition to its primary materials, this product is reinforced with carbon fiber for enhanced strength and long-lasting ESD protection. The carbon fiber reinforcement ensures durability and reliability in various applications where ESD protection is a critical requirement.

Up to 180°C bake temperature available

This product can withstand bake temperatures of up to 180°C, making it suitable for use in high-temperature environments. The ability to endure such heat levels demonstrates the product's resilience and adaptability for diverse manufacturing processes.

Industry-standard formats, customized for your needs

Available in industry-standard formats, this product can also be customized to meet specific requirements. Whether you need a standard size or a tailored design, the product offers flexibility to accommodate your unique needs and preferences.

Technical Parameters:

HN24036 Technical Data Ref.
Base Information Material Color Matrix QTY Pocket Size
ABS Black 19*12=228PCS 2.70*1.30*1.40mm
Size Length * Width * Height (according to customer's requirement)
Feature Durable; Reusable; Rcofriendly; Biodegradable
Sample A. The free samples: Choosen from existing products.
B.  Customized samples as per your design/demand
Accessory Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format PDF,2D,3D
Secure Packaging Solution ABS Bare Die Tray With Optional Lid And Clip 0

Specifications:

The variability is in the pocket size, geometry and count.

Waffle pack trays are usually specified by a few characteristics:

  • External size – 2”, 4”, etc.
  • Pocket size or pocket count – choosing one will dictate the other
  • Temperature rating – the maximum temperature at which the tray will be used

Custom waffle pack trays require additional specification:

  • Component geometry
  • Special process requirements
  • Quantity of trays needed or quantity of components that will be processed (this helps determine the appropriate manufacturing process to be used for tray manufacturing)


Secure Packaging Solution ABS Bare Die Tray With Optional Lid And Clip 1