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Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry

Name: Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry
Brand: Shenzhen Hiner Technology Co.,LTD
SKU: HN25064
Price: 0.35 USD
Availability: InStock

Brand Name:	Hiner-pack
Model Number:	HN25064
MOQ:	1000 Pcs
Price:	$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	4000PCS~5000PCS/per Day

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen,China

Certification:

ISO 9001 ROHS SGS

Optional:

Lid/Cover And Clip/Clamp

Molding Method:

Injection Moulding

Property:

ESD,Non-ESD

Warpage:

＜0.3mm

Shape:

Rectangular

Custom Logo:

Available

Heat Resistant:

Yes

Packaging Details:

It Depends On The QTY Of Order And Size Of Product

Supply Ability:

4000PCS~5000PCS/per Day

Highlight:

Bare Die Tray 11x13 capacity

Semiconductor industry die tray

143PCS bare die storage

Product Description

Product Description:

As a leading provider in the semiconductor packaging and testing industry, our firm has innovatively crafted the Die Carrier Series, tailored to fulfill the exacting demands of advanced semiconductor manufacturing. Aligning with the worldwide Semiconductor industry towards miniaturization and heightened integration, we have thoroughly comprehended the rigorous market specifications for chip packaging solutions, resulting in a comprehensive portfolio encompassing chips of all sizes. This offering boasts permanent antistatic properties, dust resistance, and robust durability, alongside unparalleled dimensional precision.

Features:

Product Name: Bare Die Trays
Customizable Logo: Available
Molding Method: Injection Moulding
Heat Resistant: Yes
Stackable: Yes
Esd Protection: Yes

Applications:

♦Temporary Storage in Semiconductor Production:

During the manufacturing and packaging of semiconductor chips, it can effectively protect the chips from physical damage and electrostatic discharge, ensuring the integrity and reliability of the chips throughout the manufacturing and packaging process.

♦Chip Transportation and Distribution:

As a professional packaging container, the bare die tray can effectively protect the chips during transportation, reducing the risk of chip failure due to physical damage or electrostatic discharge.

Customization:

Brand Name: Hiner-pack

Model Number: HN25064

Place Of Origin: Shenzhen, China

Packaging Details: It Depends On The QTY Of Order And Size Of Product

Molding Method: Injection Moulding

Heat Resistant: Yes

Outline Line Size	101.6101.66mm	Brand	Hiner-pack
Model	HN 25064	Package Type	FBGA IC
Cavity Size	5.74.22.25mm	Matrix QTY	11*13=142PCS
Material	ABS,PC	Flatness	MAX 0.3mm
Color	Black	Service	Accept OEM,ODM
Resistance	1.0x10e4-1.0x10e11Ω	Certificate	ROHS

Packing and Shipping:

♠Product Packaging:

The Bare Die Trays are carefully placed in individual compartments within a sturdy cardboard box to ensure safe transportation.

♠Shipping:

Once packed, the Bare Die Trays are sealed and labeled for shipping. They are then securely placed in a shipping box along with any necessary packing materials to prevent damage during transit.

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry

Bare Die Tray with a Capacity of 11x13=143PCS Suitable for the Semiconductor Industry

Bare Die Tray 11x13 capacity

Semiconductor industry die tray

143PCS bare die storage

Product Description:

Features:

Applications:

Customization:

Packing and Shipping: