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Custom Geometry High Precision Waffle Pack Chip Trays For Non Standard Component Protection

Brand Name:	Hiner-pack
Model Number:	HN24082
MOQ:	500
Price:	TBC
Payment Terms:	100% Prepayment
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

SHENZHEN CHINA

Certification:

ISO 9001 ROHS SGS

Molding Method:

Injection Moulding

Usage:

IC/Chip Storage And Transportation

Color:

Black

Reusable:

Yes

Material:

Capacity:

10x10=100PCS

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Packaging Details:

500 Pcs/carton(According To Actual Packing）

Supply Ability:

2000PCS/Day

Product Description

Custom Geometry High Precision Waffle Pack Chip Trays For Non Standard Component Protection

The Custom Geometry Waffle Pack Chip Tray series is specifically developed for microelectronic components that do not conform to standard rectangular dimensions. While traditional "off-the-shelf" trays often fail to provide adequate support for complex 2.5D devices, these high-precision 2-inch and 4-inch waffle packs are engineered from the ground up to match your specific device footprint.
Each tray features a thin, waffle-like profile with a regular pattern of separator ribs that create protective pockets. What sets this series apart is the integration of Moldflow analysis during the initial product mold design phase. This advanced simulation allows our engineering team to accurately predict material behavior, ensuring that the final injection-molded product achieves superior size precision and planar degree. By controlling material characteristics and mold structures with such granularity, we meet the most stringent quality requirements of the semiconductor and photonics industries.
These trays are not just carriers; they are mechanically optimized environments that safeguard, automate, and store a wide variety of products, ranging from bare die to delicate medical sensors.

Key Features/ Benefits

Engineering-Led Customization
Precision Moldflow Analysis
Rapid Development Cycle
Advanced Pocket Features
Permanent ESD Integrity
Robust Dimensional Stability

Specifications

Brand		Hiner-pack
Model		HN24082
Material		PC
Tray Type		2-inch Waffle Pack
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8x50.8x4mm
Cavity Size		1.55x0.80x0.45mm
Matrix QTY		10x10=100PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Certifications		RoHS, ISO

Applications

These custom-engineered waffle packs are the ideal solution for non-standard microelectronic assembly and specialized component handling. Their primary applications include: Prototype Assembly of New Sensors, where the pocket must match a unique physical profile; Handling of Fragile Medical Micro-Parts, such as surgical implants or diagnostic sensors; and Secure Transport of Specialized Gems or Watch Components, where high-value items require individual, anti-crush compartments. They are also widely utilized in Engineering Lines transitioning to Automation, providing a consistent interface for custom tools. Because they adhere to the unofficial industry-standard 2-inch or 4-inch footprint, they remain compatible with existing waffle pack accessories like covers and clips while offering a completely bespoke internal environment.

Customization

We provide a comprehensive "design-from-scratch" service to meet your most challenging packaging needs. Customization options extend to Component Support Features, such as pedestals that lift the part to protect bottom-side features, or Reference Marks and Fiducials molded directly into the tray to aid machine vision systems. You can specify the Material Type (Conductive ABS, PC, or high-temp resins), Color-Coding for lot identification, and even Engraving for part numbers. Whether your part requires terminal isolation or specialized pad protection, our team can optimize the pocket geometry to ensure 100% alignment. For low-volume needs, we also offer CNC machining or 3D printing options, though molded trays remain the gold standard for high-precision, ESD-safe mass production.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Factory-direct manufacturer of JEDEC & IC trays
JEDEC compliant, automation-compatible designs
OEM & ODM customization supported
Consistent quality and stable supply
Trusted by global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

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Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

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IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

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