Products

Home / Products / IC Chip Tray /

Stackable 2x2 Inch Waffle Pack Chip Trays With Secure Cover And Clip Systems

Brand Name:	Hiner-pack
Model Number:	HN24094
MOQ:	500
Price:	TBC
Payment Terms:	100% Prepayment
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

SHENZHEN CHINA

Certification:

ISO 9001 SGS ROHS

Molding Method:

Injection Moulding

Color:

Black

Warpage:

Max 0.2mm

Usage:

IC/Chip Storage And Transportation

Reusable:

Yes

Material:

ABS

Property:

ESD

Capacity:

14X7=98PCS

Packaging Details:

500 Pcs/carton(According To Actual Packing）

Supply Ability:

2000PCS/Day

Product Description

Stackable 2x2 Inch Waffle Pack Chip Trays With Secure Cover And Clip Systems

The Integrated Waffle Pack Packaging System from Hiner-pack represents a holistic approach to the secure storage and global distribution of sensitive microelectronic components. Recognizing that a tray is only as effective as the system that secures it, this product line focuses on the seamless synergy between the high-precision waffle pack chip tray, its corresponding covers, and specialized retention clips. Each 2 times 2 inch tray is engineered with a thin, space-saving profile that features a precision-molded pocket matrix for bare die and chip-scale packages (CSPs).
This system is manufactured using electrically conductive or antistatic polymers (ABS/PC) that ensure permanent protection against electrostatic discharge throughout the entire stack. By utilizing advanced Moldflow analysis during the design phase, we ensure that the interlocking features of the trays and covers maintain a high degree of flatness and mechanical alignment, preventing components from migrating between pockets or being crushed during the rigors of international transit.

Key Features/ Benefits

Holistic Stackable Design
Complete Closure with Top Covers
Universal Clip System Compatibility
Permanent ESD and RoHS Integrity
High Precision and Flatness Control
Dust-Free Cleanroom Packaging

Specifications

Brand		Hiner-pack
Model		HN24094
Material		ABS
Tray Type		2-inch Waffle Pack
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8x50.8x4mm
Cavity Size		4.95x2.2x1.16mm
Matrix QTY		14X7=98PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Certifications		RoHS, ISO

Applications

This system-level solution is the standard for End-to-End Microelectronic Logistics. Its primary applications include: International Component Shipping, where the combination of stackable trays and clips provides the necessary durability for long-distance air and sea freight; Automated Tray Handling Systems, where the consistent dimensions and flatness of the stack allow for reliable machine gripping and feeding; and Cleanroom Inventory Management, providing an organized, dust-free method for storing large volumes of bare die or optical elements. It is also an ideal choice for Field Service Kits, where technicians require a compact and secure way to carry sensitive replacement parts. By offering a complete supply base of accessories, we ensure that our customers have a one-stop solution for managing their most fragile microelectronic assets from the production line to the final user.

Customization

Customization of the waffle pack system extends beyond the tray geometry to the entire packaging assembly. We can design Custom-Height Stacks and specialized covers that accommodate taller components or those with unique surface protrusions. Our engineering team can also provide Custom-Colored Trays and Covers for rapid visual identification of different product grades or process stages. Furthermore, we offer the ability to add Laser Engraving or Molded Identification Marks on both the trays and the covers for enhanced traceability. With existing designs, we can rapidly configure a "tray + cover" combination that meets your specific process requirements, often delivering custom-tooled solutions in as little as 3 to 4 weeks, ensuring your unique components are supported by a tried and true technology.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Factory-direct manufacturer of JEDEC & IC trays
JEDEC compliant, automation-compatible designs
OEM & ODM customization supported
Consistent quality and stable supply
Trusted by global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Stackable 2x2 Inch Waffle Pack Chip Trays With Secure Cover And Clip Systems

Stackable 2x2 Inch Waffle Pack Chip Trays With Secure Cover And Clip Systems

JEDEC IC Chip Tray

RF JEDEC Matrix Trays

IC JEDEC Matrix Trays

OEM Reusable Anti Acid ESD Plastic Trays Small Size Lightweight

OEM Black Anti Static Bare Die Trays 2 Inch Non Toxic RoHS Standard

2 Inch Square Portable Black Plastic IC Chip Tray For IC Devices

ABS Single QFP Waffle Pack Tray 5.5mm Thickness High Quality

Black ESD Anti Static IC Chip Tray High Temperature Resistance For Loading Sapphire