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Permanent ESD Safe Conductive ABS Waffle Pack Chip Trays For Microchip Storage And Transport

Brand Name:	Hiner-pack
Model Number:	HN24118
MOQ:	500
Price:	TBC
Payment Terms:	100% Prepayment
Supply Ability:	2000PCS/Day

Detail Information

Product Description

Detail Information

Place of Origin:

SHENZHEN CHINA

Certification:

ISO 9001 ROHS SGS

Reusable:

Yes

Use:

Transport, Storage, Packing

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Color:

Black

Capacity:

10x10=100PCS

Warpage:

Max 0.2mm

Usage:

IC/Chip Storage And Transportation

Packaging Details:

500 Pcs/carton(According To Actual Packing）

Supply Ability:

2000PCS/Day

Product Description

Permanent ESD Safe Conductive ABS Waffle Pack Chip Trays For Microchip Storage And Transport

While rooted in the semiconductor industry, the utility of the Specialized Waffle Pack Chip Tray extends into any field requiring the management of an inventory of small, high-precision, and often fragile items.
Each tray is molded from permanently antistatic or conductive polymers (ABS/PC), providing a clean and safe environment that prevents the accumulation of dust and the risks associated with static discharge, even in non-electronic applications.
The thin, "waffle" design creates a regular pattern of separator ribs, resulting in individual, protective compartments that prevent components from touching, scratching, or crushing one another. By applying sophisticated Moldflow analysis, we ensure that every tray maintains superior flatness and size precision, making them ideal for both manual sorting and integration with automated tool handling systems.

Key Features/ Benefits

Permanent ESD Integrity
Non-Sloughing, Cleanroom Ready
Chemical and Dimensional Stability
Optimized Pocket Matrix
Secure Stacking and Shipping

Specifications

Brand		Hiner-pack
Model		HN24118
Material		ABS
Tray Type		2-inch Waffle Pack
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7x50.7x5.5mm
Cavity Size		3.96×3.06×0.77mm
Matrix QTY		10X10=100PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Certifications		RoHS, ISO

Applications

These material-specific waffle packs are indispensable for Reliability Testing and Long-Term Storage. The ambient ABS versions are the industry standard for Overseas Shipping and Logistics, where mechanical protection is the priority. The specialized bakeable versions are critical for Burn-in Testing and Component Curing, where the tray must withstand elevated temperatures without outgassing or losing its shape. They are also extensively used in Photonics and Optoelectronics packaging, where the high-purity, non-sloughing material is essential for protecting sensitive lenses and sensors. Whether your process involves simple room-temperature sorting or complex thermal profiles, we provide the specific material grade to ensure your yield remains high and your components stay protected.

Customization

We provide technical guidance to help you select the optimal material for your specific environmental requirements. Customization options include Tailored Thermal Ratings, allowing you to choose a plastic that matches your exact baking cycle, and Custom Pocket Geometries to ensure proper part support and alignment. We can also provide Color-Coded Conductive Resins (for non-bakeable versions) to help identify different product batches on the production floor. For new developments, we offer a rapid prototyping path to deliver custom-tooled, material-specific trays in as little as 3 to 4 weeks, meeting the most stringent quality requirements of the global microelectronics industry.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Factory-direct manufacturer of JEDEC & IC trays
JEDEC compliant, automation-compatible designs
OEM & ODM customization supported
Consistent quality and stable supply
Trusted by global semiconductor customers

Tags:

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

JEDEC IC Trays

JEDEC Matrix Trays

IC Chip Tray

Custom JEDEC Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Permanent ESD Safe Conductive ABS Waffle Pack Chip Trays For Microchip Storage And Transport

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