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Precision ESD IC Chip Trays for Secure Storage of Delicate Semiconductors

Precision ESD IC Chip Trays for Secure Storage of Delicate Semiconductors

Brand Name: Hiner-pack
Model Number: HN24206
MOQ: 500 pcs
Price: $1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities)
Payment Terms: T/T
Supply Ability: 2000PCS/Day
Detail Information
Place of Origin:
China
Certification:
ROHS, ISO
Tray Weight:
Varies, Typically Up To 500 Grams Per Cavity
Color:
Black
Quality Assurance:
Delivery Guarantee, Reliable Quality
Outline Line Size:
50.7×50.7×4 Mm
Cavity Size:
3x0.75 Mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Mold Type:
Injection
Reusable:
Yes
Tray Shape:
Rectangular
Clean Class:
General And Ultrasonic Cleaning
Ic Type:
BGA,QFP,QFN,LGA,PGA
Packing Level:
Transport Package
Warpage:
Warpage MAX 0.21mm
Capacity:
10x10=100 PCS
Packaging Details:
CARTON, PALLET
Supply Ability:
2000PCS/Day
Product Description
Precision ESD IC Chip Trays for Secure Storage of Delicate Semiconductors

Feature precision-engineered cavities to cradle delicate semiconductors firmly, preventing shifting and electrostatic damage during handling. Maintain stable performance in high-frequency production scenarios, reducing component loss and ensuring consistent operational reliability.


Deliver reliable ESD protection to safeguard sensitive components, maintaining performance in industrial production and storage environments. Resist wear and deformation for long-term use, supporting continuous workflow without interruptions.


Support full customization of cavity size and layout to match diverse IC specifications, aligning with clean production standards for optimal efficiency. Adapt to various automated production lines and packaging requirements, delivering tailored solutions for semiconductor manufacturers.

Key Features/ Benefits 
  • Durable construction
  • Precision cavity layout
  • Durable construction
  • Fully customizable design
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
Brand Hiner-pack
Model HN24206
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 50.7×50.7×4 mm
Cavity Size 3x0.75 mm
Matrix QTY 10x10=100 PCS
Warpage MAX 0.21mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
Suitable for semiconductor storage, production line transfer, component testing and packaging. Work seamlessly with automated pick-and-place systems and ESD-controlled environments.

Applied in chip manufacturing plants, advanced packaging facilities and electronic component suppliers. Ideal for long-term inventory storage and inter-plant transportation.
Customized Services
Provide fully tailored solutions for precision ESD IC trays. Modify cavity dimensions, spacing and layout to fit unique semiconductor chip sizes. Utilize high-performance ESD-safe material for enhanced durability. Offer prototype validation and personalized design support to meet specific production needs.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers