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8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry

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China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
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8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry

8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry
8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry 8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry 8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry 8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry

Large Image :  8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry

Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: HN24722
Payment & Shipping Terms:
Minimum Order Quantity: 50pcs
Price: $1~$100/PCS
Packaging Details: 4~10pcs/carton (According to the customer demand)
Delivery Time: 2~3 Weeks
Payment Terms: T/T
Supply Ability: 100PCS/Day

8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry

Description
Size: 8 Inch Capacity: 25 Wafers
Surface Finish: Polished Uv Resistance: Yes
Temperature: Up To 350°C Application: Semiconductor Industry
Highlight:

8 Inch Metal Wafer Cassette

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Semiconductor Packaging Metal Wafer Cassette

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25 Slot Metal Wafer Cassette

8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry

 

 

1.Product Description:

 

(1)Aluminum with wear-resistant, smooth hard-coating

 

(2)Heat-resistant up to 350°C (Al)

 

(3)Smooth slot-entry and -shape vacuum vented screws

 

(4)Design according to Semiconductor industry standard

 

 

2.Applications:

 

1. In a thermal process environment, wafers are processed in a cassette at temperatures in excess of 110° F (43° C), the upper limit of the typical structural threshold for plastic process cassettes.

This includes Chemical Vapor Deposition (CVD), Rapid Thermal Processing (RTP), and wafer annealing applications.
Bakeout - Long-term thermal bakeout applications where wafers need to be left in the oven for multiple days.

 

2. Process equipment where the wafer insertion temperature (wafer removed from the process tool) exceeds the melting point of the plastic case.

The need for higher throughput reduces the time for wafers to cool and acclimatize in the chamber.

 

3. Internal Environment Cassettes - Cluster tool automation environments where cassettes are idle in a heated vacuum environment (chamber) for multiple process steps.

 

4. Precision Carrier Requirements - Automated environments in moderate heat require dimensional accuracy that plastic cassettes cannot provide.

 

Thin Wafer Handling - During thin wafer handling, sharp thin wafers cut into the plastic case. Thick Wafer - Bonding or thick wafer applications where industry standard plastic cassettes cannot be used due to slot size.

Customization is available upon request.

 

Custom configurations are available (minimum order quantities may apply): EN electroless nickel plating on aluminum profiles for high vacuum applications; flat profile slotting for thin or thick wafers; end wall retaining handles; and dual h-bar configurations for backside wafer processing.

 

8 Inch 25 Slot Visual Metal Wafer Cassette Used In Semiconductor Packaging Technology Industry 0

3. Technical Parameters:
(1) Process Aluminum Box: (Al, HC) 8” - 25 Slot, Slant Slot (Standard)
(2) Sizes: select size cover (top), (bottom) cover (top), custom H-BAR (bottom) H-BAR (top)
(3) Aluminum, abrasion-resistant, smooth hard coating
(4) Smooth grooves and shapes Vacuum vent screws
(5) Designed to SEMI standards

Product Name 8 inch 25 Slot 
Product Size 288(L)*276(W)*205(H)mm
Capacity 25PCS
Component Material  6061 Aluminum Plate
Starting position 12.5 mm
Slot distance 6.34 mm

 

Packing and Shipping:

(1) Weight limitations.
The total weight of a single package should not exceed 25 kg.
Convenient for loading and unloading, meet the loading capacity of different means of transportation.

 

(2) Size specification.
Carton size should be less than 1.5 cubic meters.
Plastic cardboard, steel drums and other dimensions according to the actual size of the goods to determine
Ensure that the packaging can be loaded smoothly into the container, aircraft cargo cabin, etc.

 

(3) Documentation management.
Prepare bill of lading, invoice, packing list and other necessary documents.
Documentary information is complete and accurate, consistent with the actual goods.

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

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