Injection Mold Bare Die Tray With High Temperature Resistance

Injection Mold Bare Die Tray With High Temperature Resistance

Bare Die Trays, also known as waffle pack trays, are thin trays typically measuring 2 inches or 4 inches square. These trays feature a regular pattern of separator ribs that create pockets, giving them the appearance of a waffle.

Waffle pack chip trays are mainly used for handling and transporting bare die or chip scale packages (CSP). These trays are equipped with simple rectangular pockets. Custom waffle pack trays are favored in scenarios where processes already adhere to the waffle pack format but require special properties, such as bakeable material or unique pocket geometry.

Features:

1. These trays are meticulously designed to ensure that the materials utilized effectively absorb all electrostatic discharge (ESD) produced during the handling and transporting of dies.

2. The trays are engineered to be compatible with a wide temperature range, allowing for easy handling of the dies during transitions between processes. This ensures that the dies are maintained within the optimal temperature range.

3. The die trays are certified for use in a completely contaminant-free clean room environment. They are specially designed to absorb any electrical shocks that could potentially damage the dies.

4. These trays come in various sizes to accommodate different die dimensions, and are versatile enough to support all types of dies based on user preference.

Technical Parameters:

Applications:

The die tray is primarily utilized in the manufacturing and assembly processes of semiconductor dies. These trays play a crucial role as a common interface for efficiently moving dies between different production centers in semiconductor companies.

In addition to transportation, die trays also function as a reliable method for securing the dies during testing procedures and while in storage.

You can find the die tray in various semiconductor research institutions, as well as in stores and production facilities across the industry.

The main application of these trays lies in facilitating the transportation and testing of prototype semiconductor dies.