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PC Small Cavity Tray For Safe Transport Of Semiconductor Bare Dies

Brand Name:	Hiner-pack
Model Number:	HN24032
MOQ:	1000 Pcs
Price:	$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	4000PCS~5000PCS/per Day

Detail Information

Product Description

Detail Information

Place of Origin:

Shenzhen,China

Certification:

ISO 9001 ROHS SGS

Size:

2-inch (4-inch Optional)

Material:

ABS, PC, PPE, MPPO, PEI, HIPS...etc.

Custom Logo:

Available

Lid And Clip:

Optional

Capacity:

Holds Multiple Bare Dies

Property:

ESD Or Non-ESD

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Packaging Details:

It Depends On The QTY Of Order And Size Of Product

Supply Ability:

4000PCS~5000PCS/per Day

Product Description

PC Small Cavity Tray For Safe Transport Of Semiconductor Bare Dies

Whether you need to package chips, dies, COG, or other microelectronic components, the Bare Die Tray series is designed to provide a safe and efficient solution. With options available in multiple sizes and materials like Antistatic / Conductive ABS and PC, these trays offer a reliable way to transport sensitive items. In addition to the standard 2-inch and 4-inch specifications, customization is also an option to cater to individual customer needs.

Features:

Made from ESD-safe, non-sloughing, and carbon-powder-free clean polymers, these products are designed to meet industry standards for safety and cleanliness.

They are reinforced with carbon fiber for added strength and long-lasting electrostatic discharge (ESD) protection. You can trust in the durability and reliability of these materials.

These products can withstand bake temperatures of up to 180°C, making them suitable for a variety of applications that require heat resistance.

Available in industry-standard formats, these products can also be customized to meet your specific needs and requirements. Get the perfect solution tailored just for you.

Technical Parameters:

HN24032 Technical Data Ref.
Base Information	Material	Color	Matrix QTY	Pocket Size
	PC	Black	6*8=48PCS	5.383.500.67mm
Size	Length * Width * Height (according to customer's requirement)
Feature	Durable; Reusable; Rcofriendly; Biodegradable
Sample	A. The free samples: Choosen from existing products.
	B. Customized samples as per your design/demand
Accessory	Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format	PDF,2D,3D

Specifications:

The external dimensions of waffle pack chip trays are well established: 2-inch is two inches square, 4-inch is four inches square, and so on. The variability is in the pocket size, geometry and count.

Waffle pack trays are usually specified by a few characteristics.

External size – 2”, 4”, etc.
Pocket size or pocket count – choosing one will dictate the other
Temperature rating – the maximum temperature at which the tray will be used

Custom waffle pack trays require additional specification.

Component geometry
Special process requirements
Quantity of trays needed or quantity of components that will be processed (this helps determine the appropriate manufacturing process to be used for tray manufacturing)

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

PC Small Cavity Tray For Safe Transport Of Semiconductor Bare Dies

PC Small Cavity Tray For Safe Transport Of Semiconductor Bare Dies

Features:

Technical Parameters:

Specifications:

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