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ESD-Proof Tray For Chip Module Packaging And Secure Handling

Brand Name:	Hiner-pack
Model Number:	HN24030
MOQ:	1000 Pcs
Price:	$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	4000PCS~5000PCS/per Day

Detail Information

Product Description

Detail Information

Certification:

ISO 9001 ROHS SGS

Warpage:

＜0.2mm

Property:

ESD Or Non-ESD

Heat Resistant:

Yes

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Material:

ABS, PC, PPE, MPPO, PEI, HIPS...etc.

Use:

Transport, Storage, Packing

Capacity:

Holds Multiple Bare Dies

Packaging Details:

It Depends On The QTY Of Order And Size Of Product

Supply Ability:

4000PCS~5000PCS/per Day

Product Description

ESD-Proof Tray For Chip Module Packaging And Secure Handling

The Chip Tray & Waffle Pack series from Hiner-pack offers a safe and convenient solution for packaging and transporting a variety of microelectronic components including Chip, Die, COG, Optoelectronic devices, and more. These products come in various sizes and materials to suit different needs, with product specifications available in 2 inches and 4 inches. The materials used include Antistatic/Conductive ABS and PC, and can also be tailored to meet specific customer requirements.

Features:

The products are crafted from ESD-safe, non-sloughing, and carbon-powder-free clean polymers.

They are further reinforced with carbon fiber to enhance their strength and ensure permanent ESD protection. This design feature provides added durability and longevity to the products.

With the capability of withstanding bake temperatures of up to 180°C, these items offer versatility in various environments and applications. This high temperature tolerance adds to their practicality and usability.

Available in industry-standard formats, these products can also be customized to meet specific requirements and preferences. This customization option allows for tailored solutions that cater to individual needs.

Technical Parameters:

HN24030 Technical Data Ref.
Base Information	Material	Color	Matrix QTY	Pocket Size
	ABS	Black	8*8=64PCS	3.653.650.8mm
Size	Length * Width * Height (according to customer's requirement)
Feature	Durable; Reusable; Rcofriendly; Biodegradable
Sample	A. The free samples: Choosen from existing products.
	B. Customized samples as per your design/demand
Accessory	Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format	PDF,2D,3D

Specifications:

The external dimensions of waffle pack chip trays are well established: 2-inch is two inches square, 4-inch is four inches square, and so on. The variability is in the pocket size, geometry and count.

Waffle pack trays are usually specified by a few characteristics.

External size – 2”, 4”, etc.
Pocket size or pocket count – choosing one will dictate the other
Temperature rating – the maximum temperature at which the tray will be used

Custom waffle pack trays require additional specification.

Component geometry
Special process requirements
Quantity of trays needed or quantity of components that will be processed (this helps determine the appropriate manufacturing process to be used for tray manufacturing)

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

ESD-Proof Tray For Chip Module Packaging And Secure Handling

ESD-Proof Tray For Chip Module Packaging And Secure Handling

Features:

Technical Parameters:

Specifications:

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