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Cleanroom-Safe Tray For Chip Storage And Automated Operations

Brand Name:	Hiner-pack
Model Number:	HN24038
MOQ:	1000 Pcs
Price:	$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	4000PCS~5000PCS/per Day

Detail Information

Product Description

Detail Information

Certification:

ISO 9001 ROHS SGS

Size:

2-inch And 4-inch

Warpage:

＜0.2mm

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Temperature:

80°C~180°C

Optional:

Lid/Cover And Clip/Clamp

Stackable:

Yes

Injection Mold:

Lead Time 20~25 Days

Packaging Details:

It Depends On The QTY Of Order And Size Of Product

Supply Ability:

4000PCS~5000PCS/per Day

Product Description

Cleanroom-Safe Tray For Chip Storage And Automated Operations

This high-precision waffle pack chip tray (Bare Die Tray) is designed in the industry-standard 2x2 inch format, ideal for safely storing and transporting fragile semiconductor die and chip-scale packages (CSP).

Each tray is molded with a uniform pocket matrix tailored to support 2.5D components with minimal surface features. Made of electrically conductive plastic, the tray provides essential electrostatic protection while maintaining rigidity and dimensional stability.

Adaptable to automated production, this waffle pack is an essential component in microelectronic packaging, testing, and inspection workflows.

Features:

1. Compact 2x2 inch footprint suitable for small die and CSP formats;

2. Precision-molded conductive polymer ensures ESD protection and part stability;

3. Customizable pocket shapes and depths to accommodate irregular geometries;

4. Compatible with standard clip systems, stackable design with top tray cover options;

5. Durable construction resists warping and maintains alignment under handling stress;

6. Heat-resistant versions are available for thermal testing or baking environments.

Technical Parameters:

HN24038 Technical Data Ref.
Base Information	Material	Color	Matrix QTY	Pocket Size
	ABS	Black	11*8=88PCS	4.403.000.35mm
Size	Length * Width * Height (according to customer's requirement)
Feature	Durable; Reusable; Rcofriendly; Biodegradable
Sample	A. The free samples: Choosen from existing products.
	B. Customized samples as per your design/demand
Accessory	Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format	PDF,2D,3D

Applications:

Optimized for bare die, chip-scale packages, and small photonic or optical elements , this waffle tray is designed for back-end processes such as inspection, die sorting, packaging, and prototype assembly. Its precision alignment and repeatability make it particularly suitable for R&D labs, engineering lines, and pilot production setups that are moving towards automation.

The waffle tray is ideal for loading operations that require accurate alignment and repeatability . This makes it a great choice for a variety of tasks, from inspection to die sorting, packaging, and prototype assembly. Its versatility and reliability make it a crucial tool in various settings, such as R&D labs, engineering lines, and pilot production facilities.

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Cleanroom-Safe Tray For Chip Storage And Automated Operations

Cleanroom-Safe Tray For Chip Storage And Automated Operations

Features:

Technical Parameters:

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