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Stackable Tray For Microchip Storage In Static-Sensitive Environments

Brand Name:	Hiner-pack
Model Number:	HN24040
MOQ:	1000 Pcs
Price:	$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	4000PCS~5000PCS/per Day

Detail Information

Product Description

Detail Information

Certification:

ISO 9001 ROHS SGS

Color:

Black (Customizable)

Material:

ABS, PC, PPE, MPPO, PEI, HIPS...etc.

Temperature:

80°C~180°C

Surface Resistance:

1.0x10E4~1.0x10E11Ω

Stackable:

Yes

Optional:

Lid/Cover And Clip/Clamp

Injection Mold:

Lead Time 20~25 Days

Packaging Details:

It Depends On The QTY Of Order And Size Of Product

Supply Ability:

4000PCS~5000PCS/per Day

Product Description

Stackable Tray For Microchip Storage In Static-Sensitive Environments

This high-precision waffle pack chip tray (Bare Die Tray) is designed in the industry-standard 2x2 inch format, ideal for safely storing and transporting fragile semiconductor die and chip-scale packages (CSPs).

Each tray is molded with a uniform pocket matrix tailored to support 2.5D components with minimal surface features. Made of electrically conductive plastic, the tray provides essential electrostatic protection while maintaining rigidity and dimensional stability.

Adaptable to automated production, this waffle pack is an essential component in microelectronic packaging, testing, and inspection workflows.

Features:

1. The design features a compact 2x2 inch footprint that is suitable for small die and CSP formats.

2. It incorporates precision-molded conductive polymer to ensure effective ESD protection and maintain part stability.

3. Customizable pocket shapes and depths are available to accommodate irregular geometries as needed.

4. The holder is compatible with standard clip systems and offers a stackable design with top tray cover options.

5. Its durable construction is designed to resist warping and maintain alignment even under handling stress.

6. Heat-resistant versions of the holder are also available for use in thermal testing or baking environments.

Technical Parameters:

HN24040 Technical Data Ref.
Base Information	Material	Color	Matrix QTY	Pocket Size
	ABS	Black	18*9=162PCS	3.651.450.4mm
Size	Length * Width * Height (according to customer's requirement)
Feature	Durable; Reusable; Rcofriendly; Biodegradable
Sample	A. The free samples: Choosen from existing products.
	B. Customized samples as per your design/demand
Accessory	Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format	PDF,2D,3D

Applications:

Optimized for use with bare die, chip-scale packages, and small photonic or optical elements, this waffle tray is well-suited for back-end processes including inspection, die sorting, packaging, and prototype assembly.

It supports tray loading operations where precise alignment and repeatability are critical, making it ideal for R&D labs, engineering lines, and pilot production setups transitioning toward automation.

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Stackable Tray For Microchip Storage In Static-Sensitive Environments

Stackable Tray For Microchip Storage In Static-Sensitive Environments

Features:

Technical Parameters:

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