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Anti-Static Tray For Compact Storage Of Semiconductor Bare Dies

Brand Name:	Hiner-pack
Model Number:	HN24039
MOQ:	1000 Pcs
Price:	$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Payment Terms:	T/T
Supply Ability:	4000PCS~5000PCS/per Day

Detail Information

Product Description

Detail Information

Certification:

ISO 9001 ROHS SGS

Size:

2-inch And 4-inch

Optional:

Lid/Cover And Clip/Clamp

Stackable:

Yes

Durability:

Sturdy And Impact-Resistant

Application:

Transport, Storage, Packing Of Bare Die

Property:

ESD Or Non-ESD

Customizable Logo:

Available

Packaging Details:

It Depends On The QTY Of Order And Size Of Product

Supply Ability:

4000PCS~5000PCS/per Day

Product Description

Anti-Static Tray For Compact Storage Of Semiconductor Bare Dies

This meticulously crafted waffle pack chip tray features a high level of precision and is structured according to the widely-accepted 2x2 inch standard dimensions. It is specifically designed to securely house and move delicate semiconductor dies and chip-scale packages (CSPs) without risking damage. Each individual tray is crafted with a consistent grid of pockets customized to cradle 2.5D elements with minimal surface irregularities.

Constructed from electrically conductive plastic, this tray offers crucial protection against electrostatic discharge while also retaining the needed stiffness and dimensional steadiness. Its adaptability for integration into automated manufacturing processes makes it a vital element within the realms of microelectronic packaging, testing, and examination procedures.

Features:

1. Compact 2x2 inch footprint suitable for small die and CSP formats;

2. Precision-molded conductive polymer ensures ESD protection and part stability;

3. Customizable pocket shapes and depths to accommodate irregular geometries;

4. Compatible with standard clip systems, stackable design with top tray cover options;

5. Durable construction resists warping and maintains alignment under handling stress;

6. Heat-resistant versions are available for thermal testing or baking environments.

Technical Parameters:

HN24039 Technical Data Ref.
Base Information	Material	Color	Matrix QTY	Pocket Size
	ABS	Black	4*3=12PCS	10.708.200.58mm
Size	Length * Width * Height (according to customer's requirement)
Feature	Durable; Reusable; Rcofriendly; Biodegradable
Sample	A. The free samples: Choosen from existing products.
	B. Customized samples as per your design/demand
Accessory	Cover/Lid, Clip/Clamp, Tyvek paper
Artowrk Format	PDF,2D,3D

Applications:

Optimized for the use of bare die, chip-scale packages, and small photonic or optical elements, this waffle tray is specifically designed for back-end processes. These processes commonly include inspection, die sorting, packaging, and prototype assembly. The tray is engineered to facilitate tray loading operations, where precise alignment and repeatability play crucial roles. As a result, it is highly suitable for environments such as R&D labs, engineering lines, and pilot production setups that are moving towards automation.

Anti-Static Tray For Compact Storage Of Semiconductor Bare Dies 1

Tags:

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Jedec IC Trays

Jedec Matrix Trays

IC Chip Tray

Custom Jedec Trays

Waffle Pack Chip Trays

Electronic Components Tray

Bare Die Trays

Anti Static Trays

Waffle Pack Lids Clips

Gel Sticky Box

Wafer Shipping Box

Metal Wafer Cassette

Anti-Static Tray For Compact Storage Of Semiconductor Bare Dies

Anti-Static Tray For Compact Storage Of Semiconductor Bare Dies

Features:

Technical Parameters:

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