|
Product Details:
|
| Material: | ABS.PC.MPPO...etc | Color: | Black.Red.Yellow.Green.White..etc |
|---|---|---|---|
| Temperature: | General 80°C~100°C | Property: | ESD |
| Surface Resistance: | 1.0x10E4~1.0x10E11Ω | Warpage: | Less Than 0.2mm(2Inch) 0.3mm(4Inch) |
| Clean Class: | General And Ultrasonic Cleaning | Incoterms: | EXW,FOB,CIF,DDU,DDP |
| High Light: | ROHS Waffle Pack Chip Trays,Wafer Waffle Pack Chip Trays,Waffle Jedec IC Trays |
||
ROHS Stable Flatness PC Waffle Pack Chip Trays For Die
Stable Flatness Antistatic PC Waffle Pack With Different Colors Can Be Customized For Wafer Bare
For electronic products in the process of transportation and packing unavoidably will produce some friction, from the perspective of physics, friction causes electrostatic generation, and the temperature change in the weather outside, and will produce static electricity, the electrostatic if stay in electronic products, it is easy to cause a short-circuit damage to the precision of electronic products,In order to avoid this situation so its packaging materials require the use of good anti-static function of the pallet or packaging solutions.
Advantages
1. Small size, light weight, low transportation cost
2. Each tray can accommodate a large number of chips suitable for transfer or loading samples for testing
3. Stable anti-static performance, good protection chip is not hurt by resistance
4. Very good flatness, easy to operate on automatic equipment
5. It can be matched with the cover and clips of the same series, convenient to meet all kinds of shipping methods
6. Recycling, plastic material is easy to degrade after waste, no environmental concerns
7. It can be stack-able and can also ensure the design of maximum utilization of tray matrix
| Outline Size | Material | Surface Resistance | Service | Flatness | Color |
| 2" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.2mm | Customizable |
| 3" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.25mm | Customizable |
| 4" | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | Max 0.3mm | Customizable |
| Custom size | ABS.PC.PPE...etc | 1.0x10e4-1.0x10e11Ω | OEM,ODM | TBC | Customizable |
| Provide professional design and packaging for your products | |||||
Product Application
Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging
Packaging
Packaging Details:Packing according to customer's specified size
| Cavity Size | Customized Size |
| Item Material: | ABS / PC / MPPO / PPE... acceptable |
| OEM & ODM: | YES |
| Item Color: | Can be customized |
| Feature: | Durable;Reusable;Rcofriendly;Biodegradable |
| Sample: | A. The free samples: choosen from existing products. |
| B. customized samples as per your design/demand | |
| MOQ: | 500pcs. |
| Packing: | Carton or as per customer's request |
| Delivery time: | Usually 8-10 working days,depends on order quantity |
| Term of payment: | Products:100% prepayment. Mold:50% T/T deposit, 50% balance after sample confirmation |
FAQ
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.
Contact Person: Rainbow Zhu
Tel: 86 15712074114
Fax: 86-0755-29960455
