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ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die

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China Shenzhen Hiner Technology Co.,LTD certification
China Shenzhen Hiner Technology Co.,LTD certification
Customer Reviews
I was very impressed!The collaboration with Hiner-Pack went very well and fully met our Jedec customization needs, and as I mentioned, we will definitely buy more trays from this company.

—— Kenneth Duvander

Chinese suppliers who have bought the best trays so far will choose to cooperate with more projects in the future.

—— Mara Lund

こんかい今回のhiner-packのせー制ひん品トレイはほんとー本当にすばらしー素晴らしいです。すぐれ優れたひんしつ品質とせーのー性能におどろき驚きました。つぎ次のごきょーりょく協力をたのしみ楽しみにしています。

—— 本間宏紀

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—— 김종운

The goods were delivered on time and the quality was much better than I expected. Hiner-pack is really a trustworthy company!

—— George Bush

The service attitude of the company is very good, and the packing specifications of the goods are completed according to our requirements. What a great Chinese company!

—— Mariah Carey

Nous avons reçu vos produits. Le prix est bas et de haute qualité. Nous sommes très heureux de coopérer avec vous cette fois!

—— Jacqueline Bourgeois

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ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die

ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die
ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die
ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die

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Product Details:
Place of Origin: Made In China
Brand Name: Hiner-pack
Certification: ISO 9001 ROHS SGS
Model Number: 4Inch
Payment & Shipping Terms:
Minimum Order Quantity: 1000
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities)
Packaging Details: It depends on the QTY of order(eg:500Sets of 2Inch series products(Waffle tray+lid+clip:10kg/45*40*30)
Delivery Time: 5~8 working days
Payment Terms: T/T
Supply Ability: 4500~5000PCS/per day

ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die

Description
Material: ABS.PC.MPPO...etc Color: Black.Red.Yellow.Green.White..etc
Temperature: General 80°C~100°C Property: ESD
Surface Resistance: 1.0x10E4~1.0x10E11Ω Warpage: Less Than 0.2mm(2Inch) 0.3mm(4Inch)
Clean Class: General And Ultrasonic Cleaning Incoterms: EXW,FOB,CIF,DDU,DDP
High Light:

ROHS Waffle Pack Chip Trays

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Wafer Waffle Pack Chip Trays

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Waffle Jedec IC Trays

ROHS Stable Flatness PC Waffle Pack Chip Trays For Die

 

Stable Flatness Antistatic PC Waffle Pack With Different Colors Can Be Customized For Wafer Bare

 

 

For electronic products in the process of transportation and packing unavoidably will produce some friction, from the perspective of physics, friction causes electrostatic generation, and the temperature change in the weather outside, and will produce static electricity, the electrostatic if stay in electronic products, it is easy to cause a short-circuit damage to the precision of electronic products,In order to avoid this situation so its packaging materials require the use of good anti-static function of the pallet or packaging solutions.

 

Advantages


1. Small size, light weight, low transportation cost
2. Each tray can accommodate a large number of chips suitable for transfer or loading samples for testing
3. Stable anti-static performance, good protection chip is not hurt by resistance
4. Very good flatness, easy to operate on automatic equipment
5. It can be matched with the cover and clips of the same series, convenient to meet all kinds of shipping methods
6. Recycling, plastic material is easy to degrade after waste, no environmental concerns
7. It can be stack-able and can also ensure the design of maximum utilization of tray matrix

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products

 
Product Application
 
Wafer Die / Bar / Chips                  PCBA module component
Electronic component packaging  Optical device packaging
 
Packaging 


Packaging Details:Packing according to customer's specified size
 

Cavity Size Customized Size
Item Material: ABS / PC / MPPO / PPE... acceptable
OEM & ODM: YES
Item Color: Can be customized
Feature: Durable;Reusable;Rcofriendly;Biodegradable
Sample: A. The free samples: choosen from existing products.
B. customized samples as per your design/demand
MOQ: 500pcs.
Packing: Carton or as per customer's request
Delivery time: Usually 8-10 working days,depends on order quantity
Term of payment: Products:100% prepayment. Mold:50% T/T deposit, 50% balance after sample confirmation

 ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die 0
FAQ
 
Q: Can you do OEM and customized design IC tray?
A: We have strong mold manufacturing and product design capabilities, in the mass production of all kinds of IC trays also have rich experience in production.
Q: How long is your delivery time?
A: Generally 5-8 working days, depending on the actual purchase QTY of orders.
Q: Do you provide samples? is it free or extra?
A: Yes, we could offer the samples, samples may be free or charged according to different product value.and all samples shipping cost normally is by collect or as agreed.
Q: What kind of Incoterm you can do?
A: We could support to do Ex works, FOB ,CNF, CIF, CFR, DDU, DAP etc. and other incoterm as agreed.
Q: What method you can help ship the goods?
A: By sea, by air, or by express, by mail post according to customer order qty and volume.

ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die 1

ROHS Black Stable Flatness PC 2 inch 4'' Waffle Pack Chip Trays For Electronic Die 2

Contact Details
Shenzhen Hiner Technology Co.,LTD

Contact Person: Rainbow Zhu

Tel: 86 15712074114

Fax: 86-0755-29960455

Send your inquiry directly to us (0 / 3000)