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esd shipping trays Online Manufacturer

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High-Precision JEDEC Trays For Advanced Component Protection and Pick-and-Place

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Precision-Engineered JEDEC Matrix Trays with 165PCS Capacity, 0.76mm Flatness, and 322.6x136mm Outline

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4-inch 128 PCS IC Chip Tray with 0.2mm Flatness for Precision Storage and Transportation

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OEM Black Waffle Pack Chip Trays Match Automation Equipment

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Customizable JEDEC Trays For Chip Carriers Protect The Ball Head And Pin Of The Chip

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JEDEC Design Tray Pocket Size 11.93*16.5*4.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP

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Injection JEDEC Tray With Custom Cavity Design For IC Packaging And Shipping

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JEDEC Standard JEDEC IC Tray Anti-Static For CQFP48 Package Chips

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Black Bare Die Tray Warpage Within 0.3mm For Chip Storage And Packing

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Stackable Waffle Pack Bare Die Tray In Microelectronic Industry

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