China Jedec IC Trays

Standard Stackable Jedec IC Trays For BGA QFP QFN LGA PGA Tray Weight 120g - 200g

Material:MPPO.PPE.ABS.PEI

Tray Features:Stackable

Tray Shape:Rectangular
JEDEC Design Tray Pocket Size 11.93*16.5*4.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP

Mold No.:HN23083

Cavity Size/mm:11.93*16.5*4.34

Overall Size/mm:322.6x135.9x8.3
Stackable BGA Black Jedec IC Trays Conform To Automation Equipment

Mold No.:HN23076

Cavity Size/mm:18.4*36.4*3.3

Overall Size/mm:322.6x135.9x7.62
Environmentally Friendly And Reusable Anti-Static Electronics Tray Jedec Standard Matrix Tray

Mold No.:HN23073

Cavity Size/mm:10.58*10.58*2.2

Overall Size/mm:322.6x135.9x12.19
Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards

Mold No.:HN23099

Cavity Size/mm:27.3*27.3*1.66

Overall Size/mm:322.6x135.9x12.19
Standard JEDEC IC Tray for LGA Type Essential in Semiconductor Packaging Process

Mold No.:HN23072

Cavity Size/mm:21.18*16.08*2.6

Overall Size/mm:322.6x135.9x7.62
ESD Black Antistatic PPE MPPO IC Storage Packaging JEDEC Chip Tray ROHS

Mold No.:HN23067

Cavity Size/mm:8.3*9.3*1.14

Overall Dimension/mm:322.6x135.9x12.19
JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray with 3X7 21PCS Matrix Quantity

Mold No.:HN23066

Cavity Size/mm:11.3*13.3*1.17

Overall Dimension/mm:322.6x135.9x12.19
Black Chip Die BGA QFN ESD Packaging Tray For Optoelectronic Devices Tray

Mold No.:HN23081

Cavity Size/mm:8.3X24.4X2.4

Overall Size/mm:322.6x135.9x7.62
Temperature Resistance Hard ESD Tray For PCB Reusable Anti Static 7.62mm IC Chip Tray

Anti-Static:OEM ESD ESD Tray /ESD Container PCB

Heat Resistant:High Temperature 270°

Injection Mold:Lead Time 20~25Days
Rectangular Jedec IC Trays Simplified IC Packaging Solutions Height 7.62mm

Tray Features:Stackable

Size:322.6*135.9mm

IC Type:BGA,QFP,QFN,LGA,PGA
BGA QFP QFN LGA PGA IC Type Jedec Trays Surface Resistant Suitable For IC Packaging

Application:IC Packaging

Tray Weight:120~200g

Tray Features:Stackable

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Jedec IC Trays

Customized Black ESD Jedec IC Trays Ultrasonic Cleaning For PCBA Module

Antistatic PPE Green Jedec IC Trays

High Temperature Resistance Jedec IC Trays

China Jedec IC Trays

Standard Stackable Jedec IC Trays For BGA QFP QFN LGA PGA Tray Weight 120g - 200g

JEDEC Design Tray Pocket Size 11.9316.54.34mm for MEMS Device in MPPO/PPE/ABS/PEI/IDP

Stackable BGA Black Jedec IC Trays Conform To Automation Equipment

Environmentally Friendly And Reusable Anti-Static Electronics Tray Jedec Standard Matrix Tray

Turnover And Shipping BGA QFP QFN TSSOP Packaged IC TRAY Fully Compliant With JEDEC Standards

Standard JEDEC IC Tray for LGA Type Essential in Semiconductor Packaging Process

ESD Black Antistatic PPE MPPO IC Storage Packaging JEDEC Chip Tray ROHS

JEDEC IC Tray Standard BGA 11.3*13.3mm High Temperature Tray with 3X7 21PCS Matrix Quantity

Black Chip Die BGA QFN ESD Packaging Tray For Optoelectronic Devices Tray

Temperature Resistance Hard ESD Tray For PCB Reusable Anti Static 7.62mm IC Chip Tray

Rectangular Jedec IC Trays Simplified IC Packaging Solutions Height 7.62mm

BGA QFP QFN LGA PGA IC Type Jedec Trays Surface Resistant Suitable For IC Packaging

IC Chip Tray

Black Plastic Waffle Pack Tray ESD 12PCS High Temperature Tray

SGS Approved Reusable Stackable ESD Safe Trays Black With Thin Chips

Mirco Electronic Components Static Tray Conductive Precision Green

Custom Jedec Trays

ODM Customize High Temperature Jedec Tray IDP For Optical Device

Jedec Package Standards ESD Component Tray HIPS Environment Friendly

Recycled ESD Custom Jedec Trays Die Transport BGA Chips High Temperature resistance 180°C