IC Type:BGA,QFP,QFN,LGA,PGA
Size:322.6*135.9mm
Surface Resistance:1.0*10e4-1.0*10e11Ω
Color:Black
IC Type:BGA,QFP,QFN,LGA,PGA
Size:322.6*135.9mm
Surface Resistance:1.0*10e4-1.0*10e11Ω
Application:IC Packaging
Size:322.6*135.9mm
Material:MPPO.PPE.ABS.PEI.IDP
Application:IC Packaging
Tray Weight:120~200g
Color:Black
Size:322.6*135.9mm
IC Type:BGA,QFP,QFN,LGA,PGA
Material:MPPO.PPE.ABS.PEI.IDP
Tray Shape:Rectangular
Tray Weight:120~200g
IC Type:BGA,QFP,QFN,LGA,PGA
Color:Black
Application:IC Packaging
Tray Weight:120~200g
Surface Resistance:1.0*10e4-1.0*10e11Ω
Material:MPPO.PPE.ABS.PEI.IDP
Material:PES
Color:Black
Temperature:180°C
Material:PC
Color:Black
Temperature:80°C
Material:PPE
Color:Black
Temperature:150°C
Material:MPPO
Color:Blue
Temperature:150°C