custom jedec trays online manufacture

Heat Resistant Anti Static Jedec IC Trays Electronic Components Tray Heat-Resistant And Anti-Static Jedec IC Trays With Different Temperatures Can Be Customized For IC Modules 1. Standard Jedec Tray Outline ... Read More

ROHS MPPO Material JEDEC Matrix Tray For ESD Electronic Components JEDEC Matrix Tray Made Of MPPO Material With ESD Electronic Components Character Reference Material: MPPO Thickness: 7.62,12.19mm Appearance: ... Read More

Waterproof Black MPPO ESD Component Tray 7.62mm Thick For BGA IC Devices Waterproof Black MPPO Standard Jedec Trays Can Be Designed For BGA IC Devices Jedec trays is a standard-defined tray for transporting, ... Read More

Heat Resistant ESD Bare Die Trays Heat Resistant ESD IC Tray Made From Injection Moulds Can Carry Bare Die Hiner offer the ultimate protection and convenience. We offer a wide variety of matrix trays to satisfy ... Read More

Optoelectronic Components Packaging Trays Bare Die Durable Antistatic ABS Bare Die Tray With Different Size For Optoelectronic Components Hiner pack designs trays for any type of component, module, MEMS, or ... Read More

Automated Pick Place Machine ESD Tray Recycling Waterproof Customize Anti-Static Trays For Automated Pick And Place Equipment Why choose custom IC Tray? Customization means specificity, the unique cavity ... Read More

Product Description: JEDEC matrix trays generally have the same measurements, which are 12.7 x 5.35 inches (322.6 x 136mm). The thickness of the low profile trays ranges from 0.25-inch (6.35mm). This size can ... Read More

Product Description: JEDEC Matrix Tray Dimensions The universal JEDEC Matrix Trays have an identical outline. Their dimensions are 12.7 inches by 5.35 inches (322.6mm x 136mm). The low profile trays have a ... Read More

Product Description: JEDEC matrix trays come in a uniform size; measuring 12.7 x 5.35 inches (322.6 x 136mm). In addition, they feature a low profile design which consists of a 0.25-inch (6.35mm) thick material... Read More

Product Description: Standard components such as < code >BGA< /code >, < code >CSP< /code >, < code >QFP< /code >, < code >TQFP< /code >, < code >QFN< /code >, < code >TSOP< /code > and < code >SOIC< /code >, ... Read More